Combined analog architecture and functionality in a mixed-signal array

ABSTRACT

A programmable device comprises a plurality of programmable blocks, a debug interface coupled with the plurality of programmable blocks, a debug interface coupled with the plurality of programmable blocks, and a power manger coupled with the plurality of programmable blocks. The power manager is configured to supply power to a subset of the plurality of programmable blocks during debugging of the subset while maintaining a different subset of the plurality of programmable blocks in a lower power mode.

RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.14/860,515, filed on Sep. 21, 2015, which is a Continuation of U.S.patent application Ser. No. 13/916,386, filed on Jun. 12, 2013, now U.S.Pat. No. 9,143,134, issued on Sep. 22, 2015, which is a Continuation ofU.S. patent application Ser. No. 12/774,680, Filed on May 5, 2010, nowU.S. Pat. No. 8,487,655, Issued on Jul. 16, 2013, which claims thebenefit of U.S. Provisional Patent Application No. 61/175,586 filed May5, 2009, all of which are incorporated by reference herein in theirentirety.

TECHNICAL FIELD

The present disclosure relates generally to microcontrollers andparticularly to microcontrollers as part of a mixed-signal array.

BACKGROUND

Microcontrollers may have embedded processors, memories and specialfunction analog and digital circuits. Typical analog circuits found inprior art microcontrollers include Continuous Time (CT) amplifiershaving preset functions with given functional parameters. For instance,a CT analog amplifier might be configured as a fixed function circuit,such as a voltage amplifier, in which certain parameters, such as gainor bandwidth might be altered by programming.

Switched Capacitor (SC) analog circuits are also frequently incorporatedinto microcontroller designs. SC analog circuits in prior art aresomewhat more versatile than CT analog circuits in that it might bepossible to alter both the circuit function as well as the parameters ofthe circuit function by programming. However, both CT and SC analogcircuits found in current microcontrollers generally require programmingbefore utilization, and neither can be dynamically programmed(programmed “on-the-fly”).

In the conventional art, general purpose digital circuits are frequentlyincluded in a microcontroller implementation. Such digital circuits arepre-programmed to realize certain digital functions such as logicaloperations, arithmetical functions, counting, etc. These digitalcircuits are generally in the form of a Programmed Logic Array (PLA) orFPGA. Furthermore, such digital circuits that require pre-programmingare generally not dynamically programmable (programmable “on-the-fly”).The main difficulty here is in the generality of such a digital circuit,which requires an excessive amount of digital logic, which in turnoccupies a large area on a semiconductor chip as well as an increasedcost of manufacturing.

Several other design considerations related to microcontrollerutilization either go unaddressed, or require separate functionalitiesto enable them. For instance, existing designs do not offer aprogrammable analog circuit array with both CT analog circuits and SCanalog circuits on the same semiconductor chip with a programmable arrayof digital circuits. As a result, realization of a function requiringcomplex communication between analog circuits and digital circuits oftenrequires the use of multiple semiconductor chips. Further, existingmicrocontroller realizations generally require pre-programming andcannot be dynamically programmed.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated by way of example and are not intended to belimited by the figures of the accompanying drawings, in which likereferences indicate similar elements and in which:

FIG. 1 illustrates a core architecture of a Programmable System-on-Chip(PSoC®) according to an embodiment;

FIG. 2 illustrates a digital subsystem of the core architectureaccording to an embodiment;

FIG. 3 illustrates a universal digital block (UDB) of the digitalsubsystem according to an embodiment;

FIG. 4 illustrates a programmable logic device of a UDB according to anembodiment;

FIG. 5 illustrates a datapath module of a UDB according to anembodiment;

FIG. 6A illustrates a FIFO configured for a transmit/receive (TXRX)function according to an embodiment;

FIG. 6B illustrates a FIFO configured dual capture function according toan embodiment;

FIG. 6C illustrates a FIFO configured for dual buffer function accordingto an embodiment;

FIG. 7 illustrates a UDB status and control module according to anembodiment;

FIG. 8 illustrates a UDB array according to an embodiment;

FIG. 9 illustrates a UDB array with digital functions mapped onto thearray according to an embodiment;

FIG. 10 illustrates a digital routing fabric in a system according to anembodiment;

FIG. 11 illustrates an interrupt and DMA multiplexer according to anembodiment;

FIG. 12A illustrates an embodiment of IO pin output connectivityaccording to an embodiment;

FIG. 12B illustrates an embodiment of IO pin output connectivityaccording to another embodiment.

FIG. 13 illustrates a CAN bus system according to an embodiment;

FIG. 14 illustrates a block diagram for a CAN controller according to anembodiment;

FIG. 15 illustrates a block diagram for a USB controller according to anembodiment;

FIG. 16 illustrates a timer/counter/PWM fixed-function peripheral blockin-system according to an embodiment;

FIG. 17 illustrates a digital signal processing application blockdiagram according to an embodiment;

FIG. 18 illustrates a block diagram for an analog system of a corearchitecture according to an embodiment;

FIG. 19 illustrates an internal and external analog routing for ananalog subsystem according to an embodiment;

FIG. 20 illustrates a block diagram of a delta-sigma analog-to-digitalconverter according to an embodiment;

FIG. 21 illustrates four comparators of an analog subsystem to anembodiment;

FIG. 22 illustrates an opamp of an analog subsystem according to anembodiment;

FIG. 23A illustrates an opamp configured as a voltage follower accordingto an embodiment;

FIG. 23B illustrates an opamp configured as an external uncommittedopamp according to an embodiment;

FIG. 23C illustrates an opamp configured as an internal uncommittedopamp according to an embodiment;

FIG. 24 illustrates a switched capacitor/continuous time (SC/CT)functional block according to an embodiment;

FIG. 25A illustrates a SC/CT functional block configured as aprogrammable gain amplifier (PGA) according to an embodiment;

FIG. 25B illustrates a SC/CT functional block configured as atransimpedance amplifier (TIA) according to an embodiment;

FIG. 25C illustrates a SC/CT functional block configured as a mixeraccording to an embodiment;

FIG. 26 illustrates a SC/CT functional block configured as a sample andhold according to an embodiment;

FIG. 27 illustrates a block diagram of an LCD subsystem according to anembodiment;

FIG. 28 illustrates a block diagram of a digital-to-analog converter(DAC) according to an embodiment;

FIG. 29 illustrates a block diagram of a DMA in-system according to oneembodiment;

FIG. 30 illustrates an external memory interface (EMIF) according to anembodiment;

FIG. 31 illustrates a programmable analog subsystem according to anembodiment;

FIG. 32 illustrates a clocking subsystem of core architecture accordingto an embodiment;

FIG. 33 illustrates a block diagram of a clock divider according to anembodiment;

FIG. 34 illustrates a state diagram for power modes that may beimplemented by a power management subsystem of a core architectureaccording to an embodiment;

FIG. 35 illustrates a block diagram of a power subsystem of a corearchitecture according to an embodiment;

FIG. 36 illustrates a boost converter of a power subsystem according toan embodiment;

FIG. 37 illustrates a block diagram of a general purpose input/output(GPIO) of core architecture according to an embodiment;

FIG. 38 illustrates a block diagram of a specialized input/output (SIO)of a core architecture according to an embodiment;

FIG. 39 illustrates a block diagram of a USB input/output (USBIO) of acore architecture according to an embodiment;

FIG. 40A illustrates a pin configured as high-impedance analog accordingto an embodiment;

FIG. 40B illustrates a pin configured as high-impedance digitalaccording to an embodiment;

FIG. 40C illustrates a pin configured resistive pull up according to anembodiment;

FIG. 40D illustrates a pin configured as resistive pull down accordingto an embodiment;

FIG. 40E illustrates a pin configured as open drain drive low accordingto an embodiment;

FIG. 40F illustrates a pin configured as open drain drive high accordingto an embodiment;

FIG. 40G illustrates a pin configured as strong drive according to anembodiment;

FIG. 40H illustrates a pin configured as resistive pull up and downaccording to an embodiment;

FIG. 41 illustrates a block diagram of a peripheral HUB (PHUB) accordingto an embodiment;

FIG. 42 illustrates one embodiment of low-power and power-down debuggingaccording to an embodiment; and

FIG. 43 illustrates one embodiment of a method for debugging a deviceaccording to an embodiment.

DETAILED DESCRIPTION

FIG. 1 illustrates an embodiment of a core architecture 100 of aProgrammable System-on-Chip (PSoC®), such as that used in the PSoC®family of products offered by Cypress Semiconductor Corporation (SanJose, Calif.). In one embodiment, the core architecture includes adigital subsystem 110. The digital subsystem 110 includes a universaldigital block array 111, comprising a plurality of universal digitalblocks (UDBs) 112, a CAN 2.0 interface controller (CAN 2.0) 113, an I²CMaster and Slave controller (I²C M/S) 114, a plurality of multifunctiondigital blocks (MDBs) 115 and a full-speed USB 2.0 interface controller(FSUSB 2.0) 116. MDBs 115 may be configured to perform common digitalfunctions such as timers, counters and pulse-width modulators (PWMs).Digital subsystem 110 may also include communication peripherals such asEthernet, high-speed USB, USB host, PCI Express, IEE1394 serial businterface, SD card reader and others (not shown) The elements of digitalsystem 110 may be coupled to digital interconnect 152 and/or to thesystem bus 154.

The core architecture may also include an analog subsystem 120. Theanalog subsystem may include an LCD direct drive block 121, a digitalfilter block (DFB) 122, a plurality of switched-capacitor/continuoustime mixed-function analog (SC/CT) blocks 123, a temperature sensorblock 124, a capacitive sensing (CapSense™) block 125, a plurality ofdigital-to-analog converters 126, an analog-to-digital converter (ADC)127 including a delta-sigma ADC 128, a plurality of operationalamplifiers (opamps) 129 and a plurality of comparators (CMP) 130. Analogsubsystem 120 may include successive approximation registers (SARs),programmable gain amplifiers (PGAs) and other analog peripherals (notshown). The elements of analog subsystem 120 may be coupled to analoginterconnect 150 and/or the system bus 154. CapSense™ block 125 may becoupled to the analog interconnect 150 separate from other elements ofanalog subsystem 120.

The core architecture 100 may also include memory subsystem 135, CPUsubsystem 140 and programming and debug subsystem 145. Memory subsystem135 may include an EEPROM block 136, synchronous random access memory(SRAM) 137, an external memory interface (EMIF) block 138, and flashmemory (FLASH) 139. Memory subystem 135 may also include a memory cacheor memory accelerator (not shown). CPU subsystem 140 may include a CPU141, an interrupt controller 142 and a bus bridge controller (DMA/PHUB)143, which may include a direct memory access (DMA) controller 144. Theprogram and debug subsystem 145 may include a programming block 146, anddebug and trace block 147 and a boundary scan block 148. The program anddebug subsystem may be coupled to the CPU subsystem. The CPU subsystemand the memory system may be coupled to system bus 154. The memorysubsystem 135 may be coupled to the CPU subsystem 140 through the systembus 154. In one embodiment, FLASH 139 may be coupled to the CPU 141directly.

The core architecture 100 may also include system-wide resources 160.System-wide resources may include a clocking subsystem 161 and powermanagement subsystem 171. Clocking subsystem 161 may include an internallow-speed oscillator block (ILO) 162, a watch-dog timer (WDT) andwake-up controller block 163, a real-time clock (RTC)/timer block 164,an internal main oscillator block (IMO) 165, a crystal oscillator block(Xtal Osc) 166, a clock tree 167, power manager 168 and reset block 169.In one embodiment the RTC/timer block 164 and the ILO 162 may be coupledto the WDT and wake-up controller block 163. In another embodiment,clock tree 167 may be coupled to Xtal Osc block 166 and IMO 165. Powermanagement system 171 may include power-on-reset (POR) andlow-voltage-detect (LVD) block 172, a sleep power block 173, a 1.8Vinternal regulator (LDO) 174, a switched mode power supply (e.g,switch-mode pump, SMP) 175 and power manager 178. The switched modepower supply may implement a boost circuit, a bust circuit or both.Power manager 178 may be coupled to power manager 168 of the clockingsubsystem 161. In one embodiment, system-wide resources 160 may becoupled to system bus 154.

The core architecture 100 may also include a plurality of pins 102. Pins102 may be used to connect elements of core architecture 100 to off-chipelements or route signals into, out of on-chip elements or to differentpins of the device. Core architecture 100 may also include a pluralityof special input/outputs (SIOs) 104 and general purpose input/outputs(GPIOs) 106. SIOs 104 may be coupled to digital interconnect 152. GPIOs106 may be coupled to analog interconnect 150, digital interconnect 152,RTC/timer block 164, and/or Xtal Osc block 166. Core architecture mayalso include USB input/outputs (USB PHY) 108, which may be coupled toFSUSB 2.0 116.

Digital Subsystem

FIG. 2 illustrates one embodiment 200 of digital subsystem 110 (FIG. 1).The digital subsystem 200 is configurable to perform digital signalprocessing functions including but not limited to pulse-widthmodulators, timers, counters, I2C communication, SPI communication, UARTcommunication, cyclical redundancy checks, pseudo-random sequencegenerators, digital LCD drivers, state machines, digital multiplexorsand sequencers, decimators, shift registers as well as combination oflogic gates. Mixed-signal operations enabled by the digital subsystemmay include but not be limited to analog-to-digital converters,digital-to-analog converters, mixers, modulators and demodulators whencoupled to the elements of the analog subsystem (e.g., 120, FIG. 1). Thedigital system includes highly configurable universal digital blocks(e.g., UDBs, 112, FIG. 1), which may be configured to perform variousdigital functions alone or in combination with other UDBs. Further, UDBsmay be partitioned and their resources shared to optimized mapping ofdigital functions onto an array of UDBs. An example of this is shown inFIG. 9 and discussed later in this specification.

Digital subsystem 200 may include a plurality of digital core systemelements 210, such as clock dividers and memory, fixed functionperipherals 215 and IO ports 220 coupled to a digital routing fabric(e.g., digital system interconnect—DSI) 230. DSI 230 may be coupled toUDB array 240, which may include a plurality of UDBs (245). UDBs 245,fixed function peripherals 215, IO ports 220, interrupts 250, DMA 260and digital core system elements 210 may be coupled to the DSI 230 toimplement full-featured device connectivity. DSI 230 may allow anydigital function to be routed to any pin 102 (FIG. 1) or other featureto be routed when coupled through UDB array 240. In one embodiment, UDBs145 may be a collection of uncommitted logic (PLD) and structural logicoptimized to create common embedded peripherals and customizedfunctionality that are application- or design-specific. In oneembodiment UDBs 145 may be arranged in a matrix with a homogenousstructure to allow flexible mapping of digital functions onto the array.The array may support extensive and flexible routing interconnectsbetween UDBs 245 and DSI 230.

In another embodiment, UDBs may be implemented using CPLD or FPGAelements singly, together or in combination with configurable orfixe-function logic elements, memories and/or look-up tables (LUTs).

FIG. 3 illustrates one embodiment of a UDB 300, for example as found inFIGS. 1 (112) and 2 (245). UDBs may be configured to perform digitalfunctions alone or in combination with other UDBs by using a highlyconfigurable interconnect and chaining structure which allows UDBs toshare unused resources with other groups of UDBs.

UDB 300 may include a first programmable logic device (PLD) 310 coupledto PLD chaining IO 301, routing channel 360 through routing IO 307 and asecond PLD 320. Second PLD 320 may be coupled to PLD chaining IO 302,first PLD 310 and routing channel 360 through routing IO 308. UDB 300may also include a clock and reset control block 330, which may becoupled to a status and control block 340. Status and control block 340may be coupled to routing channel 360 through routing IOs 305 and 306.UDB 300 may also include a datapath module 350 which is coupled throughto datapath modules of other UDBs through datapath chaining IOs 303 and304. PLDs 310 and 320 may take inputs from the routing channel 360 andform registered or combinational sum-of-products logic and may be usedto implement state machines, state bits and combinational logicequations. In some embodiments, PLD configurations may be automaticallygenerated from graphical primitives, where functions are mapped to thePLD the PLD is configured based on the settings of those functions. Insome embodiments, datapath module 350 may be an datapath containingstructured logic to implement a dynamically configurable arithmeticlogic unit (ALU) and a variety of compare configurations of conditions.The datapath module 350 may also contain input/output FIFOs to serve asthe parallel data interface between the CPU system 140 (FIG. 1) and theUDB 300. The status and control block 330 may be used by the UDB 300 tointeract with and synchronize to the CPU (e.g., 141, FIG. 1).

FIG. 4 illustrates one embodiment of a PLD 400 as part of a UDB (e.g.,300, FIG. 3) and linked to other UDBs and PLDs (e.g., 310 and 320, FIG.3). The PLD of a UDB is configurable to provide generic logic such as anAND gate, an OR gate and a flip flop used for synthesizing Verilogwritten during development. PLD 400 may include an AND array 410 ofinputs 415 and product terms 413. For each product term 411 the true (T)or complement (C) of each input 415 may be selected. In one embodiment,there may be eight product terms 413 and twelve inputs 415. In otherembodiments there may be more or less than eight product terms 413 andtwelve inputs 415. Product terms from the AND array 410 are ANDedthrough AND functions 425 to create an OR array 420 of product terms421. The product terms 421 may be summed through OR functions 430 tocreate PLD outputs 451-454. The summed output of OR functions 425 may bebetween one and the maximum number of product terms wide. Eight productterms are shown as part of PLD 400. In one embodiment, the width of theOR gate may be constant across all outputs. In another embodiment, thewidth of the OR gate may be variable.

FIG. 5 illustrates one embodiment of a datapath module 500 implementedin a UDB (e.g., 300, FIG. 3) as well as the chaining of multipledatapaths from multiple UDBs. The datapath includes an arithmetic logicunit (e.g. ALU 528) as well blank data registers which may be configuredto implement a flag when the counter is finished, or in anotherembodiment when a status output for when a timer reaches a threshold.The datapath allows chaining and MUXing of UDBs to created largerdigital functions. For example, two UDBs may be chained together toprovide higher-bit functionality. Datapath module 500 may include one ormore inputs 501 from a programmable routing to one or more inputmultiplexors 502. Inputs 501 connect the datapath module 500 to therouting matrix and provide the configuration for the datapath operationto perform in each cycle and the serial data inputs. Inputs may berouted from other UDBs, other device peripherals, device IO pins orother system elements. The output of the input multiplexors 502 may becoupled to a control store RAM 504. In one embodiment, control store RAM504 may be a memory array, wherein unique configurations may be stored.Control store RAM may then be coupled to datapath control 505. PHUBsystem bus 510 may provide read- and write-access to datapath registersF1 512, F0 514, D1 516, D0 518, A1 520, and A0 522. Datapath registers512-522 may be combined or used individually and routed through MUXes524 and 526. Parallel input PI 523 may also be routed from programmablerouting through MUX 524. MUXes 524 and 526 may have outputs that arecoupled to arithmetic logic unit (ALU) 528. Parallel output PO 525 mayalso be routed from the output of MUX 524 to programmable routing. ALU528 may be coupled to shift function 530. Shift function 530 may becoupled to mask function 532. Outputs 544 to the programmable routingmay be selected from the general conditions and the serial data outputs.Outputs 544 may be routed to other UDBs, device peripherals, interruptcontrollers, the DMA, IO pins and other system elements. Datapaths maybe chained through chaining block 540 with inputs from A0 , A0 , D0, D1and data from previous datapath 545 to chaining block 540. Outputs arerouted to the programmable routing 544 through a plurality of outputMUXes 542 or to/from the next datapath 547.

Datapath 500 may include six primary working registers 512-522, whichmay be accessed by the CPU (FIG. 1) or DMA (FIG. 1) during deviceoperation. Primary working registers 512-522 may be categorized asaccumulators (A0 522 and A1 520), data registers (D0 518 and D1 516) orFIFOs (F0 514 and F1 512). In one embodiment, accumulators may besources and sinks for ALU 528 or sources for compares. Data registersmay be sources for ALU 528 as well as for compares. FIFOs may be primaryinterfaces to system bus 154 (FIG. 1). FIFOs may also be data sourcesfor the data registers and accumulators. FIFOs may also capture datafrom accumulators from ALU 528. In one embodiment, each FIFO may be fourbytes deep.

ALU 528 may be configured to perform a variety of general-purposefunctions by writing to ALU control registers (not shown) or sendingcontrol signals to ALU 528. Digital functions may include Increment,Decrement, Add, Subtract, Logical AND, Logical OR, and Logical XOR.Digital functions may be reloaded into the ALU 528 and selected bywriting to ALU control registers (not shown) by the CPU (e.g., 141,FIG. 1) or the DMA controller (e.g., 144, FIG. 1). Datapath 500 may alsobe configured to perform functions independent of ALU 528 operation.Such functions may include Shift Left, Shift Right, Nibble Swap, andBitwise OR Mask.

Datapath module 500 may be optimized to implement embedded functionssuch as times, counters, integrators, PWMs, pseudo-random sequencegenerators (PRSs), cyclic redundancy checks (CRCs), shifters, dead bandgenerators and other digital functions by writing to ALU controlregisters (not shown) with the CPU (e.g., 141, FIG. 1) or the DMAcontroller (e.g., 144, FIG. 1).

In one embodiment, datapath 500 may be configured to chain conditionsand signals with neighboring datapaths to create higher-precisionarithmetic, shift, CRC or PRS functions.

In one embodiment, ALU 528 may be shared in applications that are oversampled or do not need high clock rates. Carry and shift out data fromALU 528 may be stored in data registers and may be selected as inputs insubsequent cycles. Such a configuration may provide support forfunctions that require greater bit lengths that are available in asingle datapath.

In one embodiment, conditions may be created by datapath module 500which may include two compare operands. The two compares of datapath 500may have bit masking options. Compare operands may include accumulatorsA0 522 and A1 520 and data registers D0 518 and D1 516 in a variety ofconfigurations. Other conditions created by datapath module 500 mayinclude zero detect, all ones detect and overflow. Conditions may be theprimary outputs of datapath 500. The outputs of datapath 500 may bedriven out to the UDB routing matrix. In one embodiment, conditionalcomputation can use the built in chaining to neighboring UDBs to operateon wider data widths without the need to use routing resources.

In one embodiment, the most significant bit (MSB) of ALU 528 and shiftfunction 530 may be programmatically specified to support variable-widthCRC and PRS functions. In conjunction with masking function 532, the MSBof ALU 528 and shift function 530 may implement arbitrary-width timers,counters and shift blocks.

Datapath module 500 may include built-in support for single-cycle CRCcomputation and PRS generation of arbitrary width and arbitrarypolynomial. CRC and PRS functions longer than eight bits may beimplemented in conjunction with PLD logic, or built-in chaining may beused to extend the functions into neighboring UBDs.

FIFOs F0 514 and F1 512 may be four bytes deep and configuredindependently as an input buffer or an output buffer. In the case of aninput buffer, system bus 154 (FIG. 1) may write to the FIFO and datapathmodule 500 may perform and internal read of the FIFO. In the case of anoutput buffer, datapath module 500 may perform an internal write to theFIFO and system bus 154 may read from the FIFO. FIFOs F0 514 and F1 512may generate a status that is selectable as a datapath output and can bedriven to routing. Once driven to routing, the status generated by F0514 and F1 512 may interact with sequencers to move the device betweenstates or to execute ordered functions, interact with interrupts togenerate tasks in software or interact with the DMA to store the statusto a memory location or registers without consuming CPU overhead.

FIGS. 6A-6C illustrate example FIFO configurations which may beconstructed, for example, with the datapath described with respect toFIG. 5. FIG. 6A illustrates an example FIFO configuration for atransmit/receive (TXRX) function 600. System bus 654 is coupled to F0614. F0 614 is coupled to either datapath D0 or datapath D1 in block 617and then coupled to either accumulator A0 , accumulator A1 or ALU 528(FIG. 5) in block 628. The output of block 628 is coupled to F1 612. F1612 is coupled to system bus 654.

FIG. 6B illustrates an example FIFO configuration for a dual capturefunction 601. Accumulator A0 , accumulator A1 or ALU 528 (FIG. 5) inblock 628 may be coupled to either F0 614 or F1 612. F0 614 and F1 612are coupled to system bus 654.

FIG. 6C illustrates an example FIFO configuration for a dual bufferfunction 602. System bus 654 is coupled to F0 614. F0 614 is coupled todatapath 618 and accumulator 622. System bus 654 is also coupled to F1612. F1 612 is coupled to datapath D1 616 and accumulator A1 620.

FIG. 7 illustrates a UDB status and control module 700 (e.g., 340, FIG.3) according to one embodiment. The UDB status and control module 700includes status and control registers 710, and 720, respectively, whichmay be accessed and set to enable, disable, configure and reconfigurethe UDBs. The status and control module 700 routes data from thedatapath and places that information into a status register 710. Signalsfrom the datapath are then easily accessible by other system componentswithout required datapath overhead.

UDB status and control module 700 includes routing channel 705. Routingchannel 705 may be coupled to status register 710 and control register720. Status register 710 and control register 720 are coupled to systembus 754. In one embodiment, the bits of control register 720, which maybe written to by the system bus 754, may be used to drive into therouting matrix and provide firmware with the opportunity to control thestate of UDB processing. The status register 710 may allow the state ofthe UDB to be read out onto the system bus 754 directly from internalrouting. Status register 710 and control register 720 may haveprogrammable connections to the routing matrix, which allows routingconnections to be made depending on the requirements of the application.

FIG. 8 illustrates a UDB array 800 according to one embodiment. UDBarray 800 includes DSI routing interfaces 805 and 810. Array 800 alsoincludes horizontal and vertical (HV) routing channels 815 and 825. Inone embodiment, HV routing channels 815 and 825 may include of 96 wires.HV routing channels 815 and 825, wire connections to UDBs 845, and theDSI interface may be highly permutable. The permutability providesefficient automatic routing, which may allow wire-by-wire segmentationalong the vertical and horizontal routing channels 815 and 825 tofurther increase routing flexibility and capability.

FIG. 9 illustrates a UDB array 900 according to one embodiment withdigital functions mapped onto the UDB array 900. Functions areimplemented by configuring UDBs 945 in an array to perform digitalfunctions. Functions that are mapped onto the UDB array 900 include atimer 912, decoder 914, sequencer 916, PWM 918, PRS 920, I2C slave 922,SPI 924, timer 926, logic 928, SPI 930, UART 932, logic 934 and PWM 936.In this embodiment, the primary programmable resources of UDBs are twoPLDs, one datapath and one status/control register. These resources maybe allocated independently. UDB PLDs, datapaths and status controlregisters may have independently selectable clocks and may be allocatedto multiple unrelated functions. As an example, timer 912 uses only onedatapath in a UDB 945, which allows other resources of UDB 945 to beused for other functions, such as quadrature encoder 914, which mayrequire more PLD logic that one UDB can supply. Programmable resourcesin the array 900 may be homogenous, allowing functions to be mapped toarbitrary boundaries in the array. While UDB array 900 has functionsmapped to it in such a way as to consume all of its UDBs, applicationrequirements may require a different set of digital functions that maynot use all digital resources. Additionally, the mapped functions ofFIG. 9 are intended to be representative of one application. UDB array900 may be configured to implement a different set of functions or thesame functions in a different configuration.

FIG. 10 illustrates one embodiment of a DSI routing in an overalldigital subsystem 1000. DSI 1015 may function as a continuation of thehorizontal and vertical routing channels 815 and 825 (FIG. 8) at the topand bottom of an array 1010 of UDBs. The DSI may provide general purposeprogrammable routing between device peripherals such as UDBs (e.g., 112,FIG. 1), IOs (e.g., 104 and 106, FIG. 1), the analog subsystem (e.g.,120, FIG. 1), interrupts generated by the CPU (e.g., 141, FIG. 1), theDMA controller e.g., 144, FIG. 1) and fixed function peripherals. TheDSI is used to send and receive signals to any digital resource. Signalsmay include inputs from IOs and peripherals, outputs from digitalresources to other system elements, control signals and status queries.

In some embodiments, device peripherals that are connected by DSI 1015may include timers and counters 1020, a CAN interface 1022, an I2Cinterface 1024, an interrupt controller 1026, a DMA controller 1028, IOport pins 1030, global clocks 1032, an EMIF 1038, delta-sigma ADCs 1040,SC/CT blocks 1042, DACs 1044, comparators 1046, IO ports (not shown) orany other digital core or fixed function peripheral that may useprogrammable routing. Signals that may use programmable routing mayinclude:

-   -   interrupt requests form all digital peripherals in a system,    -   DMA requests from all digital peripherals in a system    -   digital peripheral data signals that need flexible routing to        IOs,    -   digital peripheral data signals that need connection to UDBs    -   connections to the interrupt and DMA controllers    -   connections to IO pins, and    -   connections to analog system digital signals.

Interrupt and DMA routing may be made even more flexible in the DSI,which may allow for more efficient and faster routing of signals andconfiguration of digital subsystem components. FIG. 11 illustrates oneembodiment of an interrupt and DMA controller 1100. Fixed-functioninterrupt request lines (IRQs) 1101 may be routed into UDB array throughinput 1111 and out through output 1113. Fixed-function DRQs 1102 may berouted into UDB array 1110 through input 1112 and out through output1114. IRQs 1103 may then be routed through an edge detect 1120 throughinput 1121 and output 1122. DRQs 1104 may be routed through an edgedetect 1130 through input 1131 and output 1132. Fixed-function DRQs,DRQs and the output of edge detect 1130 may be rouged through MUX 1150to the input of DMA controller 1170. Fixed-function IRQs, IRQs from theUDB array 1110, the output of DMA controller 1170 and the output of edgedetect 1120 may be routed through MUX 1140 to interrupt controller 1160.

FIG. 12A illustrates an embodiment of the IO pin output connectivity1200. Eight IO data output connections from the UDB array DSI 1205 arerouted to port pins 1210-1217 through MUXes 1220-1227. The first fourdata output connections from the UDB array DSI may be coupled to thefirst four port pins 1210-1213 through the first four MUXs 1220-1223.The second four data output connections from the UDB array DSI may becoupled to the second four port pins 1214-1217 through the second fourMUXs 1224-1227. FIG. 12B illustrates another embodiment 1201 of IP pinoutput connectivity wherein four more DSI connections to an IO port toimplement dynamic output enable control of pins. IO control signalsconnections from USB array DSI may be routed to output enable pins1250-1257 through MUXes 1260-1267. In one embodiment, MUXes 1260-1267may receive all DSI signals globally. In another embodiment, MUXes1260-1267 may receive a subset of the available DSI signals or a susbsetof MUXes 1260-1267 may receive all DSI signals or a subset of theavailable DSI signals.

FIG. 13 illustrates a controller area network (CAN) bus system 1300. ACAN bus system may be used to communicate over a CAN bus network toother devices. CAN bus system 1300 includes a plurality of CAN nodes1301-1303. While there are three nodes shown in FIG. 13, it would beobvious to one of ordinary skill to have more or less than three CANnodes in a CAN bus system 1300. Each CAN node includes CAN drivers 1312and a CAN controller 1314. In one embodiment, CAN drivers 1312 and CANcontroller 1314 are implemented in a PSoC™ device 1312. CAN nodes mayalso include a CAN tranceiver 1320 coupled to the CAN drivers 1312 andCAN controller 1314 through TX/RX signals and an enable signal. CANnodes may also be coupled to CAN bus 1330 through CAN_H and CAN_Lsignals. In one embodiment, CAN drivers 1312 may run on the CPU (e.g.,141, FIG. 1).

FIG. 14 illustrates a block diagram for a CAN controller 1400 from CANbus system (FIG. 13) and the digital subsystem (e.g., 113, FIG. 2). TheCAN controller may be configured to send and receive signals on a CANbus and to configure signals received by other system elements to meetthe protocol requirements of the CAN bus. CAN controller 1400 includes aTX block 1410 which contains TX message, TX request and TX abortinformation for each data packet to be communicated by the CANcontroller. Information from the TX block is routed to the TX CAN framer1414 and CRC generator 1416 through priority arbiter 1412. Signals arerouted from CRC generator 1416 to the TX pin 1401. Signals are receivedby the CAN controller through RX pin 1402. Signals received at the RXpin 1402 may be routed to a WakeUp request block 1407 or the RX messagehandler 1450 through CRC check block 1426 and RX CAN framer 1424. RXmessage handler 1450 assigned mask information to data received throughRX pin 1402 and routes the signal to one or more of a plurality ofacceptance masks 1452. Information is routed from the plurality ofacceptance masks 1452 to the acceptance codes 1454 and then to generatecreated massages in block 1455. Received messages in block 1456 may thenbe routed back to the priority arbiter 1412, generate a RX interrupt inblock 1462 or be routed back in the main digital subsystem. TX interruptrequests are received from TX block 1410. Bit timing block 1405 iscoupled to the output of CRC generator 1416 and CRC the input of CRCgenerator 1426 as well as to error status block 1430 and error detectionblock 1440.

The CAN bus interface may be compliant with the Bosch v 2.0B CAN-Busspecification and implemented an industry standard AMBA AHB bus and aPhilips compatible PHY interface. In one embodiment, the CAN controllermay operate as a slave device with configuration, control and datamanaged by an application processor or external DMA controller. The CANcontroller may support one or more interrupts and may or may not providea AHB DMA request signal.

The digital subsystem may include a USB communication interface, capableof supporting control interrupt, bulk and/or isochronous USB transfertypes. The USB communication interface may be configured to send andreceive signals to other USB devices on a bus. FIG. 15 illustrates ablock diagram of the USB controller 1500 of the digital subsystemaccording to one embodiment. Pins 1501 and 1502 connect to D+ and D−inputs, respectively and coupled to USBIO block 1560. Signals may berouted through USBIO 1560 to serial interface engine (SIE) 1530. SIE1530 may be coupled to arbiter 1520 and 48 MHz IMO 1540 in oneembodiment. In another embodiment, arbiter 1520 and RAM (not shown) mybe replaced by a request to a DMA controller (e.g., 144, FIG. 1) thatenables the SIE to share memory from a memory subsystem (e.g., 135, FIG.1). SIE may generate interrupts and communicate back to the digitalsubsystem through system bus 1570. Arbiter 1520 may be coupled to systembus 1570 and to SRAM 1550. In another embodiment, USBIO 1560 may beexternal to the device and interface to the SIE through an interfaceprotocol such as USB 2.0 Transceiver Macrocell Interface (UTMI) or UTMI+Low Pin Interface (ULP).

The digital subsystem may include one or more multifunction digitalblocks (MDBs) configurable as a timer, a counter, a PWM or other commondigital functions. Multifunction digital blocks provide optimizeddigital resources that may be easily configured to implement commondigital functions. Such dedicated peripherals may be emulated in UDBs toincrease the number of such blocks in the application. However,dedicated resources that may be configured to perform basic digitalfunctions allows more configurable resources to be configured to performcomplex functions which may require more resources than a single blockmay provide. FIG. 16 illustrates a block diagram of the inputs andoutput of the MDB 1601. The MDB 1601 may select from multiple clocksources 1610 with input and output signals connected through DSIrouting. DSI routing allows connection to any device pin and anyinternal signal accessible through the DSI. Each MDB may have a compareoutput 1680, terminal count output 1670 and a programmable interruptrequest line (IRQ) 1660. MDB 1601 may be configured as free-running,one-shot 1620 or enable-input 1630 controlled and have timer rest andcapture inputs 1640 and a kill input 1650 for control of the comparatoroutputs. In another embodiment, MDBs and UDBs, as shown in FIG. 3, maybe configurable such that functions between MDBs and UDBs areinterchangeable.

Digital subsystem may include a digital signal processing block (e.g.,digital filter block—DFB). FIG. 17 illustrates a DFB application 1700block diagram. DFB application 1700 includes a DFB 1710 with an inputconnection from BUSCLK 1702 and input/output connections to and fromdigital routing 1704. DFB application 1700 includes system bus 1720,which sends write_data and address signals, 1714 and 1716, to the DFB1720. DB 1710 sends read_data signals 1712 to system bus 1720. DFB 1710also sends DMA request signals 1718 to DMA control block 1730. Datasource block 1740 couples into system bus 1720. Data destination block1750 couples from system bus 1720. DFB architecture is described in moredetail in U.S. patent application Ser. No. 11/865,672 filed by Mar etal. and assigned to Cypress Semiconductor Corporation (San Jose,Calif.).

In one embodiment, a DFB may be a fixed-point, programmable limitedscope DSP engine with a AHB-Lite DMA capable slave interface.Configuration, status memory test, signal and coefficient data movinginto or out of the DFB may pass across the AHB interface. A DFB maysupport multiple streaming data channels, where programminginstructions, historic data and filter coefficients and results arestored locally with new period data samples received from the AHBinterface. System software may load sample and coefficient data into andout of DFB data RAMs and/or reprogram for different filter operation.Such configurations may allow for multi-channel processing or deeperfilters that would be supported in local memory. The DFB may alsoprovide a software-configurable interrupt and multiple DMA channelsupport. Semaphore bits may be available for software to interact withthe DSP assembly program. In one embodiment, data movement may becontrolled by the system DMA to be moved by hardware with limited CPUoverhead. In another embodiment, data may be moved directly by themicrocontroller if there are no available DMA channels, if theapplication requires it for program execution timing and steps.

The DFB may support multiple input and multiple output data ports,accessible through DMA or directly by the system CPU. These ports maysupport accesses of varied widths and have coherency protection hardwareallowing them to be written or read in multiple accesses of less thanfull width accesses. Coherency protection may allow processing of widedata through narrow busses without corruption.

The DFB may support internal clock gating by splitting the bus blockinto three gated clock domains. A first clock domain may clock the DFBcore and the majority of the block. A second clock domain may clock theAHB interface and a third clock domain may be a combination of the firstand second clock domains as described. In one embodiment, the DFB maycontain embedded register files for internal data storage and input,output storage to and from the AHB interface. Multiple clock domains mayallow for different rates of clocking for different program functions.For example, a program block may have a first clocking domain for theinput and a second clocking domain for the output.

The DFB may provide a multiple accumulate (MAC) operation in one clockcycle. This may enable finite impulse response (FIR), infinite impulseresponse (IIR) and other filters, offloading the main CPU whilesignificantly improving execution speed of the filter operation if doneby the CPU.

DFB may have multiple modes of operation. In one embodiment, the DFB mayhave block mode and streaming mode. Block mode may be used to set up theDFB for operation by loading data, coefficients, instructions, andfinite state machine (FSM) control RAMs for operation. The DFB core maybe halted and the embedded memories accessed by the AHB bus interface.Block mode may be used to enable multiple channels, multiple filters orboth in a time-division multiplexed fashion. Block mode may also be usedto enable filter depths larger than local DFB memory may allow.Streaming mode may be used to maximize performance and minimize systembandwidth usage by storing instruction sets and sample and coefficientdata in local DMA memory. In one embodiment, only new incoming datasamples, outgoing filter results and control and stat information may betransferred across the AHB bus. In streaming mode, the DFB may wait forperiodic data samples, process the data, update results and notifysystem software through DMA or an interrupt when the filter cycle iscomplete and another data sample may be received.

Analog Subsystem

An analog programmable subsystem can create application specificcombinations of standard analog signaling blocks and advanced analogsignal processing blocks. These blocks can be interconnected to eachother, to any pin on the device or to digital and system components.This interconnectivity provides a high level of design flexibility andIP security. An analog programmable system may include, but are notlimited to, the following features:

-   -   a flexible, configurable analog routing architecture including        analog globals, an analog multiplexor bus (MUX bus) and analog        local buses,    -   a high resolution delta-sigma ADC,    -   DACs capable of providing voltage or current output,    -   comparators with optional connections to configurable look-up        table (LUT) outputs,    -   configurable switched capacitor/continuous time (SC/CT) blocks,    -   opamps for internal subsystem use and connection to GPIO,    -   a capacitive sensing subsystem,    -   voltage or current references,    -   current sources and/or sinks,    -   IO ports,    -   temperature sensors, and    -   optical sensors.

FIG. 18 illustrates a block diagram of one embodiment of an analogsubsystem 1800 as may be seen in FIG. 1 (analog subsystem 120). Theanalog subsystem 1800 may include several banks of analog blocks such asDACs, opamps, comparators, switched-capacitor/continuous time functionalblocks, delta-sigma analog-to-digital converters, precision references,and capacitive sensing channels signals to and from which may be routedto any part of the system (e.g., 100, FIG. 1) through a highlyconfigurable analog interconnect. The analog interconnect may becontrolled by several system elements including, but not limited to, ananalog interface controller, a peripheral hub controller, a directmemory access controller a microprocessor, which may be part of a CPUsubsystem (e.g., 140, FIG. 1), digital subsystem elements such as UDBs(e.g., 112, FIG. 1), or IOs. The configurable interconnect and theflexibility of its control (which may be achieved through any number ofsystem components) allows for more flexible and faster signal processingwhile decreasing overall CPU overhead.

References and external signals may be routed to anywhere in the analogsubsystem through a highly configurable analog interconnect which allowsfor a high number of possible references and connection of multiplereferences to different blocks, banks of blocks or channels.

GPIO Ports 1802 may be coupled to analog routing 1804. Analog routing1804 may be coupled to DACs 1811-1814, DelSig ADC 1816, Opamps1821-1824, SC/CT blocks 1826-1829, comparators (CMP) 1831-1834 andcapacitive sensing (CapSense™) subsystem 1836. Precision reference 1818may be coupled to DelSig ADC 1816. DACs 1811-1814, DelSig ADC 1816,precision reference 1818, opamps 1821-1824, SC/CT blocks 1826-1829, CMPs1831-1834 and CapSense™ subsystem 1836 may be coupled to each other orto analog interface 1840 through internal analog routing 1841. Analoginterface 1840 may include a configuration and status registers block1842. Analog interface may be coupled to DSI array 1870, clockdistribution block 1880, decimator 1890 and PHUB 1850. PHUB 1850 may becoupled to CPU 1860.

FIG. 19 illustrates one embodiment of internal and external analogrouting 1900, examples of which are shown in FIG. 1 (150) and FIG. 18(1841). Analog routing 1900 exists as a series of buses, switches andMUXs that interwoven amongst the analog subsystem (e.g., 120, FIG. 1),which allows analog blocks, banks of blocks and channels to be connectedto each other, to internal and external reference signals, tomixed-signal blocks (such as DACs) as well as to GPIO. Analog routing1900 includes sixteen analog globals (AG) 1905 and two analog MUX buses(AMUXBUS) 1910. AGs and AMUXBUSes may connect GPIOs 1915 to analogfunctional blocks. Analog functional blocks may include a low-passfilter 1921, a comparator 1922, a capacitive sensing block 1923, SC/CTfunctional block 1924, a voltage/current digital-to-analog converter(VIDAC) 1925 and a DSM 1926. Each GPIO 1915 may be coupled to one AG1905 and one AMUXBUS 1910. Each GPIO 1915 may be coupled to acorresponding AG 1905 through an analog switch 1901. Analog switches1901 may be large or small. Large analog switches 1901 have lower Z.Small analog switches 1901 have higher Z. The AMUXBUS 1910 may be ashared routing resource connecting every GPIO 1905 through an analogswitch 1901. Analog routing 1900 may also include eight analog localbuses 1930 to route signals between different analog functional blocks1921-1926. In one embodiment, there may be eight analog local buses1930, four on the right side of the device and four on the left side ofthe device. Analog local buses 1930 from the right and left sides of thedevice may be coupled together through analog switches 1902. Analogrouting 1900 may also include MUXes and switches for IO selection of theanalog functional blocks. In one embodiment, analog routing 1900 mayprovide hierarchical routing to system components. In anotherembodiment, analog routing 1900 may allow for free, uncontrolled routingto system components.

FIG. 20 illustrates a block diagram of one embodiment of a delta-sigmaADC 2000 shown in FIG. 18 (1816) and coupled to the analog interconnect1841 (FIG. 18). Delta-sigma ADC 2000 is part of a the analog subsystem(e.g., 120, FIG. 1) and is capable of receiving signals from severalsources including but not limited to GPIO, precision references, digitalsubsystem elements (e.g., 110, FIG. 1) and the DMA controller (e.g.,144, FIG. 1). Delta-sigma ADC 2010 includes an input buffer 2020, adelta-sigma modulator 2030 and a decimator 2040. Input buffer 2020 iscoupled to internal and external buses input MUXes 2001 and 2005. Thesignals from input MUXes 2001 and 2005 may be coupled directly todelta-sigma modulator 2030 in one embodiment. In another embodiment, thesignals from input MUXes 2001 and 2005 may be coupled to delta-sigmamodulator 2030 through input buffer 2020, which eliminates load from theinput of delta-sigma modulator 2030. In normal operations, delta-sigmamodulator 2030 may oversample the input and generate a serial datastream output. The high-speed data stream may be passed throughdecimator 2040. Decimator 2040 may convert the high-speed serial datastream into parallel ADC results. Resolution and sample rate ofdelta-sigma ADC 2010 may be controlled through decimator 2040.

Delta-sigma ADC 2000 may be configured to operation in a plurality ofmodes. These modes may include: single sample, fast filter, continuousor fast FIR (average). Modes may be started by a write to a start bit ina control register or an assertion of the Start of Conversion (SOC)signal 2051. End of conversion (EOC) signal 2055 may assert high andremain high until the value is read by either the DMA controller or theCPU when the conversion is complete.

In single sample mode, delta-sigma ADC 2000 may perform one sampleconversion on a trigger. In this mode, delta-sigma ADC 2000 remains in astandby state until SOC signal 2051 is asserted. When SOC signal 2051 isasserted, delta-sigma ADC 2000 may perform one sample conversion andcapture the result. The system may poll a control register for status orconfigure the EOC signal to generate an interrupt or invoke a DMArequest to detect the end of the conversion. When the conversion iscomplete, delta-sigma ADC 2000 may reenter the standby state where itsays until another SOC event.

In continuous mode, delta-sigma ADC may be reset and then runcontinuously until stopped. This mode may be used when the input signalis not switched betweens sources and multiple samples are required.

In fast filter mode, back-to-back signals may be captured continuouslyand delta-sigma ADC 2000 reset between each sample. On completion of onesample, delta-sigma 2000 may be reset and another sample begumimmediately. The results of the conversions may then be transferredusing at least one of polling, interrupts or DMA request.

Fast FIR (average) mode may operate similar to fast filter mode, butwithout resetting the delta-sigma ADC 2000 between intermediateconversions. Fast FIR (average) mode may be used when decimation ratiosgreater than what is available from the standard ADC are required. Forthis mode, a post processor filter may be used to perform additionaldecimator to obtain resolutions greater than are natively available inthe ADC.

FIG. 21 illustrates one embodiment of a comparator set 2100, or bank, offour analog comparators 2110, 2120, 2130 and 2140 coupled by theiroutput to analog interface (ANAIF) 2105. Comparators 2110, 2120, 2130and 2140 may be coupled to the reset of the analog subsystem shown inFIG. 18 or to the rest of the device through the analog interconnectshown in FIG. 19. The output of each comparator may also be routedanywhere on the device through the same programmable interconnect. Inone embodiment, each comparator input and output is controlled by theDMA controller (144, FIG. 1) to offload the CPU (CPU 141). In an anotherembodiment, the comparator signals may be controlled by the analoginterface controller 2105 and coupled to other analog subsystem elementssuch as low-pass filters (1921, FIG. 19) or to GPIO through theprogrammable interconnect shown in FIG. 19.

Each comparator (2110, 2120, 2130, 2140) has a positive and negativeinput that couples to the analog routing and an output that couples toanalog interface (ANAIF) 2150, which includes LUTs 2151-2154. LUTs2151-2154 may be two input, one output LUTs that are driven by any oneor two of the comparators in the device. The output of LUTs 2151-2154may be routed to UDBs 2160 through the DSI of the UDB array. From theDSI of the UDB array, signals from LUTs 2151-2154 may be coupled toUDBs, the DMA controller, IOs or the interrupt controller. In anotherembodiment, comparator outputs may be coupled to the UDBs without beingrouted through LUTs 2151-2154.

FIG. 22 illustrates one embodiment of an opamp circuit 2200. Opampcircuits are illustrated as part of the analog subsystem 1800 (FIG. 18)and may be coupled through their inputs or outputs to other analogsubsystem components or to other system elements, shown in FIG. 1. Opampcircuit 2200 includes opamp 2210 having negative input 2211, positiveinput 2212 and output 2213. Negative input 2211 may be coupled to theoutput of MUX 2240 having inputs coupled to the analog global bus.Negative input 2211 may also be coupled to a GPIO through analog switch2222. Positive input 2212 of opamp 2110 may be coupled to the analogglobal bus, a reference voltage (VREF), or the analog internal busthrough multiplexor 2250. Positive input 2212 may also be coupled to aGPIO through analog switch 2223. The output 2213 of opamp 2210 may becoupled to a GPIO or to the negative input 2211 through analog switch2221. Opamp 2200 may be an uncommitted analog resource and may beconfigured as a gain stage or voltage follower, or an output buffer onexternal or internal signals. Opamp speed modes may include, but not belimited to slow, low, medium and fast, which may set by writing to opampcontrol registers (not shown) by the CPU (e.g., 141, FIG. 1) or by theDMA controller (e.g., 144, FIG. 1). UDBs or other digital subsystemblocks may control and configure the opamp circuit 2200, but do so byinvoking the DMA controller. Slow mode consumes the least amount ofquiescent power and fast mode consumes the most power. The inputs may beable to swing rail-to-rail.

FIGS. 23A-C illustrate possible opamp configurations for opamp 2200(FIG. 22). Opamps are configured to perform functions by settingregisters that control switch operations and connections. Theseregisters may be hard-coded during development or controlled by a numberof system-level elements including, but not limited to the analoginterface controller (FIG. 20), the CPU (e.g., 141, FIG. 1), UDBs (e.g.,945, FIG. 9), or the DMA controller (e.g., 144, FIG. 1). Opamp registersettings and switches may be controlled through the analog interconnectshown in FIG. 19.

FIG. 23A illustrates an opamp configured as a voltage follower 2301according to one embodiment. Opamp 2310 includes negative input 2311,positive input 2312 and output 2313. Positive input 2312 is coupled to avoltage input Vin. Output 2313 is coupled to a pin 2331 as an outputvoltage, Vout, and to negative input 2311.

FIG. 23B illustrates an opamp configured as an external uncommittedopamp 2302 according to one embodiment. Negative input 2311 is coupledto a negative voltage, Vn, through a GPIO 2332. Positive input 2312 iscoupled to a positive voltage, Vp, through a GPIO 2333. Output 2313 iscoupled to a pin 2334 as an output voltage, Vout.

FIG. 23C illustrates an opamp configured as an internal uncommittedopamp 2303 according to one embodiment. Negative input 2311 is coupledto an internal negative voltage, Vn. Positive input 2312 is coupled toan internal positive voltage, Vp. Output 2313 is coupled to a pin 2335as an output voltage, Vout.

Internal and external opamps such as those illustrated by FIGS. 23B and23C may be used to implement analog functions including inverting andnon-inverting amplifiers, active filters, current and voltage sources,differential amplifiers, instrumentation amplifiers comparators andother analog functions with signals generated by the device itself orwith signal generated by external components

FIG. 24 illustrates one embodiment of the switched-capacitor/continuoustime (SC/CT) functional block 2400, which is part of the analogsubsystem 1800 (FIG. 18) and coupled to analog routing 1841 (FIG. 18),shown in FIG. 19. The SC/CT functional block is configurable to performa number of analog functions which require either switched-capacitoroperation, continuous time operation or both by controlling switchesthat route signals into and out of an opamp. These switches arecontrolled through register settings which may be written to by a numberof sources including but not limited to the analog interface (FIG. 20),the DMA controller (e.g., 144, FIG. 1), the CPU (e.g., 141, FIG. 1) orthe digital subsystem shown in FIG. 2.

The SC/CT functional block 2400 is built around a single rail-to-railhigh bandwidth opamp 2410. Opamp 2410 includes a negative input 2411, apositive input 2412 and an output 2413. Capacitors 2433 and 2434 andvariable resistor 2431 may be coupled to the negative input 2411 throughswitches 2486, 2488 and 2484 respectively. Capacitors 2433 and 2434 andvariable resistor 2431 may be coupled to the output 2413 throughswitches 2485, 2487 and 2483 respectively. The output 2413 may becoupled to negative input 2411 through switch 2482. Output 2413 may becoupled to an output voltage, Vout, or to one input of comparator 2420.The other input of comparator 2420 may be coupled to a referencevoltage, Vref. Output 2413 may be coupled to capacitor 2439 throughswitch 2468. Positive input 2412 may be coupled to ground through switch2469. Positive input 2412 may be coupled to capacitor 2439 throughswitches 2465 and 2467, to capacitor 2438 through switches 2465 and 2466or to the output of MUX 2471 through switch 2451. The input of MUX 2471may be coupled to an input voltage, Vin, or a reference voltage, Vref.Capacitor 2438 may be coupled to ground. Positive input 2412 may becoupled to the output of MUX 2471 through switches 2463 and 2452, toground through switches 2463 and 2464, or to capacitor 2435 throughswitch 2463. Capacitor 2435 may be coupled to an output voltage, Vout, areference voltage, Vref, or a ground voltage, Vgnd, through switches2455, 2454 or 2453, respectively. Negative input 2411 may be coupled tothe output of MUX 2471 through switches 2462 and 2452, to ground throughswitches 2462 and 2464, or to capacitor 2435 through switch 2463.Negative output 2411 may be coupled to variable resistor 2432 throughswitch 2459 or to capacitor 2436 through switch 2460. Capacitor 2436 maybe coupled to ground through switch 2461. Capacitor 2436 may be coupledto an input voltage, Vin, or an output voltage, Vout, through switches2457 or 2456, respectively. Variable resistor 2432 may be coupled to theoutput of MUX 2472 though switch 2458. The input of MUX 2472 may becoupled to an input voltage, Vin, or a reference voltage, Vref.

The SC/CT functional block may use capacitors and switches to createswitched-capacitor (SC) analog functions. These circuits operate bymoving charge between capacitors by opening and closing switches.Non-overlapping clock signals control the switches so that not allswitches are ON simultaneously. Opamp 2410 may also be connected to anarray of resistors to allow constructions of a variety of continuoustime (CT) functions. Opamp 2410, and associated capacitors, resistorsand switches may be programmed to perform analog functions including butnot limited to:

-   -   naked operational amplifier, continuous mode,    -   unity-gain buffer, continuous mode,    -   programmable gain amplifier (PGA), continuous mode,    -   transimpedance amplifier (TIA), continuous mode,    -   up/down mixer, continuous mode,    -   non-return-to-zero sample and hold mixer (NRZ S/H), switched        capacitor mode, and    -   first order delta-sigma modulator for an analog-to-digital        converter—switched capacitor mode.

To perform the naked opamp analog function, inputs 2411 and 2412 andoutput 2413 are configured for connection to internal or externalsignals. The opamp may have a unity gain bandwidth greater than 6 MHzand output drive current up to 650 uA, which is sufficient for bufferinginternal signals and driving external loads greater than 7.5 kohms.

The SC/CT functional block may be configured as a unity gain bufferusing same configuration as may be used for the naked opamp analogfunction, with output 2413 coupled directly to an inverting input for again of 1.00. With this configuration, the SC/CT functional block willhave −3 dB bandwidth greater than 6 MHz.

FIG. 25A illustrates one embodiment of a PGA 2501 implemented by theSC/CT functional block shown in FIG. 24. Negative input 2511 of opamp2510 is coupled between resistors R1 2532 and R2 2531, which areconnected in series between the output of MUX 2572 and output 2513.Positive input 2512 is coupled to the output of MUX 2571. The gain ofthe PGA may switched from inverting and non-inverting by changing theshared select value, S, of both input MUXes 2571 and 2572. The gain maybe adjusted by changing the values of R1 2532 and R2 2531.

FIG. 25B illustrates one embodiment of a TIA 2502 implemented by theSC/CT functional block shown in FIG. 24. Negative input 2511 of opamp2510 is coupled to an input current, Iin, and output 2513 throughresistor Rfb 2530. Positive input 2512 is coupled to a referencevoltage, Vref.

FIG. 25C illustrates one embodiment of a mixer 2503 implemented by theSC/CT functional block shown in FIG. 24. Negative input 2511 of opamp2510 may be coupled to variable resistors 2532 and 2531 and capacitorsC1 2533 and C2 2534. Negative input 2511 may also be coupled to output2513 through switch 2582. Output 2513 may be coupled to the oppositeside of variable resistors 2532 and 2531 and capacitors C1 2533 and C22534 and produce and output voltage, Vout. The side of resistor 2532opposite negative input 2511 may be coupled to an input voltage, Vin,and to one input of MUX 2571. Another input of MUX 2571 may be coupledto a reference voltage, Vref. The output of MUX 2571 may be coupled topositive input 2512. MUX 2571 may be controlled buy a clock signal,sc_clk. Mixing applications contain an input signal frequency and alocal oscillator frequency. The polarity of the clock alternates theamplifier between inverting or non-inverting gain. The output of themixer is the product of the input and the switching function from thelocal oscillator, with frequency components at the local oscillator plusand minus the signal frequency and reduced-level frequency components atodd integer multiples of the local oscillator frequency.

FIG. 26 illustrates one embodiment of a sample and hold 2600 implementedby the SC/CT functional block shown in FIG. 24. Positive input 2612 ofopamp 2610 is coupled to ground. In a first phase, negative input 2611is coupled between capacitors C3 2635 and C4 2638, which are in series.Also in a first phase, capacitor C1 2636 is coupled between an inputvoltage, Vin, and ground and capacitor C2 2634 is coupled between areference voltage, Vref, and ground. Also in a first phase capacitor C32635 is couple between a reference voltage, Vref and negative input 2611and capacitor C4 2638 is coupled between output 2613 and negative input2611. In a second phase, capacitor C1 2636 is coupled between areference voltage, Vref, and negative input 2611 and capacitor C2 iscoupled between output 2613 and negative input 2611. Also in a secondphase, capacitor C3 2635 is coupled between an input voltage, Vin, andground and capacitor C4 2638 is coupled between a reference voltage,Vref, and ground. In some embodiments the first and second phases may beopposite phases of a clock.

In another embodiment, the SC/CT functional block may be configured as amixer to down convert an input signal. This circuit may have a highbandwidth passive sample network that can sample input signals and holdthose signals using the opamp 2600. The output frequency may be thedifference between the input frequency and the highest integer multipleof the local oscillator that is less than the input.

In another embodiment, the SC/CT functional block may be configured as afirst-order modulator by placing the SC/CT in an integrator mode andusing a comparator to provide a feedback to the input. A referencevoltage may then be either subtracted or added to the input signal. Theoutput is then the output of the comparator and not the integrator inthe modulator. The signal may then be downshifted and buffered andprocessed by a decimator to make a delta-sigma converter of a counter tomake an incremental converter. The accuracy of the sampled data from thefirst-order modulator may be determined by several factors.

FIG. 27 illustrates a block diagram of an LCD system 2700 from FIG. 1(121). The LCD system allows the system of FIG. 1 to perform analog,digital and mixed-signal processing and to display data on an LCDwithout a separate, external LCD controller, streamlining andsimplifying design. LCD system may include an LCD driver block 2710coupled to an LCD DAC 2720, a UDB 2730, PHUB 2770 and pin 2760. UDB 2730may be coupled to global clock 2780, DMA 2740 and LCD driver block 2710.PHUB 2770 may be coupled to DMA 2740, display RAM 2750 and LCD driverblock 2710. The LCD driver block may include at least one LCD segmentpin driver, which is configured to buffer the appropriate output of theLCD DAC 2720 to drive the class of an LCD directly. A register settingmay determine whether the pin is a common or a segment. The pin's LCDdriver may then select a bias voltage to drive the IP pin, asappropriate for the display data. In some embodiments, there may be sixbias voltages. In other embodiments, there may be more or less than sixbias voltages. UDB 2730 may be configured to generate global LCD controlsignals and clocking. Signals may be routed to each LCD pin driverthrough a set of dedicated LCD global routing channels. In addition togenerating the global LCD control signals, UDB 2730 may produce a DMArequest to initiate transfer of the next frame of LCD data. LCD DAC 2720may generate the contrast control and bias voltage for the LCD system2700. LCD DAC 2720 may produce a variety of voltages, plus a groundvoltage. In some embodiments, there may be five voltages from LCD DAC2720. In other embodiments there may be more or less that five voltages.Bias voltages may be driven out to GPIO pins on dedicated LCD bias bus.

FIG. 28 illustrates a block diagram of a DAC 2800. DAC 2800 may includea reference source block 2810 coupled to a scaler block 2820. The scalerblock may be coupled to an Isource range block 2830, an Isink rangeblock 2840 or an output voltage, Vout. A resistor network includingresistors 2851 and 2852, switch 2853 and ground may be coupled inparallel to scaler block 2820 and Vout. DAC 2800 may be configured aseither a current DAC (IDAC) or a voltage DAC (VDAC, not shown).

FIG. 31 illustrates another embodiment of a programmable analogsubsystem 3100 (e.g., 120, FIGS. 1 and 1800, FIG. 18). CPU 3110, DMA3115, Interrupt Controller 3120 and power block (POR, LVD, Sleep & SPC)3125 are coupled to the PHUB, 3190. Also coupled to the PHUB 3190 arethe DFB 3135 and analog interface controller 3140. DFB 3135 and aplurality of UDBs 3145, which are part of a USB array 3142, are coupledto the DSI 3195. DFB 3135 and analog interface 3140 are coupled to theanalog subsystem 3155 which comprises a bank of SAR DACs 3160, a bank ofDSMs 3165, a bank of SC/CT functional blocks 3170, a bank of comparators3175, and LCD channel 3180 and a capacitive sensing (CapSense™) channel3185. SAR DAC bank 3160, DSM bank 3165, SC/CT bank 3170, COMP bank 3175,LCD channel 3180 and CapSense channel 3185 may be coupled to DSI 3195. Aprogrammable reference generation block 3130 may be coupled to theanalog subsystem 1350.

Reconfigurable routing of the analog subsystem allows IOs to be routedto any analog resource as a bank of functions (DAC, comparators, SC/CTfunctional blocks, opamps, etc.). Additionally, reconfigurable routingof the analog subsystem may allow intra-block routing or intra-channelrouting for specific functions (DAC, comparators, SC/CT functionalblocks, opamps, etc.). The reconfigurable routing may be controlled bythe microprocessor (CPU), the DMA, register interfaces or byprogrammable digital logic. In one embodiment, UDBs may be configured toprovide the programmable digital logic that controls the analogreconfigurability.

Signal processing characteristics of analog and mixed-signal blocks,banks (of blocks) or channels may be controlled by programmable digitallogic regardless of their type. For example, an ADC and a comparator,which are not part of the same analog block or bank or channel may bereconfigured to output or process signals by the same control element,such as a UDB or DMA controller.

Data and clock signals from analog and mixed-signal blocks, banks orchannels may be routed on-chip to other analog and mixed signal blocks,banks or channels or to digital subsystem components to extend thesignal processing capability of the device. For example a digitalfiltering of an ADC output, spread spectrum clocking and clocking withvariable jitter may be accomplished by routing analog and mixed-signaloutputs through the programmable interconnect to other on-chip elements.

Additionally, analog and mixed-signal blocks, banks and channels may becontrolled synchronously or asynchronously by digital signals from theclocking or digital subsystems through the analog routing (shown in FIG.19).

Memory Subsystem

Core architecture 100 (FIG. 1) may include a memory subsystem includingstatic RAM (e.g., 137, FIG. 1), flash program memory (e.g., 139, FIG.1), EEPROM (e.g., 136, FIG. 1), and an external memory interface (e.g.,EMIF, 138, FIG. 1). Static RAM may be used for temporary data storageand may be accessed by the CPU (e.g., 141, FIG. 1) or the DMA controller(e.g., 144, FIG. 1). Access to static RAM may be accessed by the CPU orthe DMA controller at different times or simultaneously.

FIG. 29 illustrates a block diagram of a DMA controller 2912 in a system2900 according to one embodiment. The DMA controller (e.g. 144, FIG. 1)is part of the CPU subsystem (e.g., 140, FIG. 1) or be a separate,independent function, but access the memory subsystem to configureprogrammable analog and digital resources as well as to route signalsfrom one system element to another without increasing CPU bandwidthoverhead. The DMA may be invoked by the interrupt controller, byelements of the digital subsystem or by the CPU (e.g., 141, FIG. 1).

DMA controller 2912 and a CPU interface (CPU I/F) 2914 are part of aperipheral hub (PHUB) 2910. PHUB 2910 may be coupled to the UDB array2930 shown in FIG. 2, the memory subsystem (e.g., 135, FIG. 1), the USBcontroller 2950 or other system peripherals 2960, which may includeelements of the analog subsystem (FIG. 18), the digital subsystem (FIG.2) or system-wide resources (e.g., 160, FIG. 1). The DMA controller2912, through the PHUB 2910 may be coupled to the CPU 2920 (e.g., 141,FIG. 1), which may also receive signals from the UDB array 2930.

Flash memory provides nonvolatile storage for user firmware, userconfiguration data, bulk data storage and optional error correcting code(ECC). In some embodiments, flash space may be allocated to ECCspecifically. In other embodiments, the flash space allocated to ECC maybe reallocated to other flash memory functions when not used for ECC.ECC may correct and detect errors in firmware memory. In someembodiments an interrupt may be generated when an error is detected.

Programming of flash memory may be performed through a special interfaceand preempt code execution out of flash memory. The flash programminginterface may perform flash erasing, programming and setting codeprotection levels. Flash in-system serial programming (ISSP), typicallyused for production programming, may be possible through both the SWDand JTAG interfaces. In-system programming, typically used forbootloaders, may be completed through interfaces such as I2C, USB, UART,SPI or other communication protocols. Flash memory may include aflexible flash protection model that prevents access and visibility toon-chip flash memory. The flash protection module may preventduplication or reverse engineering of proprietary code.

EEPROM memory may be a byte addressable nonvolatile memory. Reads fromEEPROM may be random access at the byte level. Reads may be completeddirectly; writes may be completed by sending write commands to an EEPROMprogramming interface. CPU code execution may continue using programsstored in flash memory during EEPROM writes. EEPROM may be erasable andwriteable at the row level. In some embodiments, EEPROM may be dividedinto 128 rows of 16 bytes each. In other embodiments, EEPROM may bedivided into more or fewer rows or more or fewer bytes.

FIG. 30 illustrates one embodiment of an EMIF 3010 in a system 3000.EMIF 3010 is coupled to a UDB 3020 for sending and receiving of EMcontrol signals and other control signals. EMIF 3010 is coupled to PHUB3030 for sending and receiving data, address and control signals. PHUB3030 is coupled UDB 3020 for sending and receiving data, address andcontrol signals. PHUB 3030 is coupled to IO interface (IO IF) 3040 forsending and receiving data, address and control signals. IO IF 3040 andUDB 3030 (through the DSI) are coupled to IO ports 3051 for connectionto pin 3061 for control. IO IF 3040 and UDB 3030 (through DSI dynamicoutput control) are coupled to IO port 3052 for connection to pin 3062for control for external memory data. IO IF 3040 is coupled to IO port3053 for connection to pin 3063 for control for external memoryaddressing. EMIF 3010 may allow read and write accesses to externalmemories. EMIF 3010 may support synchronous and asynchronous memories,and may support either one type of memory at a time or bothsimultaneously.

Clocking Subsystem

The clocking subsystem of the core architecture generates, divides anddistributes clocks through the system. Internal and external clocksallow for optimized accuracy, power and cost. All or some system clocksources may be used to generate clock frequencies determined by theapplication requirements with clock dividers and UDBs. Clock generationmay be automatically configured through a development environment, suchas the PSoC Creator™ IDE graphical interface distributed by CypressSemiconductor Corporation (San Jose, Calif.).

FIG. 32 illustrates one embodiment of the clocking subsystem 3200, alsoshown in FIG. 1 (161). Clocking subsystem may include IMO 3210. IMO 3210may output a stable clock and may operate with no external components.IMO 3210 may be locked to an external frequency, such as a USB signalingfrequency, an RS232 bit period, and I2C clock or other externallyprovided signals of known frequency, period or duration. IMO 3210, inconjunction with PLL 3225 may allow generation of CPU and system clocksup to the device's maximum frequency. High-speed external crystaloscillator (ECO) 3230 provides a high-frequency, high-precision clockusing an external crystal. Oscillator 3230 may support a number ofcrystal types within a specified range. When used in conjunction withPLL 3225, oscillator 3230 may generate CPU and system clocks up to thedevice's maximum frequency. DSI 3232 provides routing or clocks takenfrom external clocks connected to IO or generated within the device inthe digital system or UDBs. In some embodiments, the primary DSI clockmay provide access to all clocking resources and up to eight other DSIclocks, which may be generated internally or externally. Access toclocking resources may be used by system resources to achieve digital,analog or mixed-signal functions which require clocking to controlswitches, provide reference signals for timers and counters, and processsignals from ADCs and DACs. In other embodiments, the primary DSI clockmay be routed directly to digital clock dividers 3261-3268. While eightdigital clock dividers are shown, it would be obvious to one of ordinaryskill in the art to implement more or fewer clock dividers. Low-speedECO 3240 provides precision timing with minimal power consumption usingan external watch crystal for on-chip clocking resources are not lowenough power or high enough precision for an application. The Low-speedECO 3240 may also coupled to the sleep timer directly and provide thesource for a Real Time Clock (RTC). Low-speed ECO may operate in twopower modes, high or low, which allows for lower power consumption orgreater noise immunity from neighboring circuits, depending on theapplication requirements. Low-speed ECO power modes are set by the CPUin run-time or during development by setting associated registers.Internal low-speed oscillator (ILO) 3250 provides clock frequencies forlow power consumption, including a watchdog timer (WDT) and a sleeptimer. In some embodiments, ILO 3250 may generate three differentclocks. In other embodiments, ILO 3250 may generate more or less thanthree clocks. A central timewheel (CTW) of the device may be thefree-running counter clocked by the ILO. The CTW may be enabled unlessthe device is in hibernate mode or when the CPU is stopped during debugon chip mode. The CTW may be used to generate periodic interrupts fortiming purposes or to wake the system from a lower power mode. The CTWmay be reset using firmware by writing to a reset register of theclocking subsystem. PLL 3225 allows low-frequency, high-accuracy clocksto be multiplied to higher frequencies for applications that requireclock frequencies higher than what are native to the clocking subsystem3220. PLL 3225 provides a mechanism for generating clock frequenciesbased upon a variety of input sources. PLL 3225 has input and feedbackdividers that supply enough discrete ratios to create almost any desiredsystem clock frequency and may be configured to use a clock from the IMO3210, high-speed ECO 3220 or DSI 3230. Clock doubler 3225 may output aclock at twice the frequency of the input clock for easy doubling ofclock signals for higher frequency applications. In one embodiment,clock doubler is configured to use a clock from IMO 3210, high-speed ECO3220, or DSI 3230. System clock MUX 3235 selects and supplies the fastedclock in the system for general system clock requirements and clocksynchronization of the device. This ensures that the device is runningat its fastest for the selected power mode. If a higher clock sourcethat what is active is available, the system clock MUX 3225 changes theclocking input for the system to the faster clock source. Bus clockdivider 3245 uses the system clock MUX output to generate the system'sbus clock used for data transfers and by the CPU. Fully programmabledigital clock dividers 3261-3268 may generate digital subsystem clocksfor general use in the digital system, as configured by designrequirements. Digital subsystem clocks may generate custom clocksderived from any of the clock sources for any purpose. In someembodiments, purposes that may require clocks generated by the digitalclock dividers 3261-3268 may include baud rate generators, accurate PWMperiods, timer clocks or other digital functions. For applications thatrequire more digital clock dividers than are available, UDBs and fixedfunction timers, counters or PWMs may generate clocks for use by thedigital subsystem. Analog clock dividers 3281-3284 may generate clocksfor analog system components that require clocking. Analog clockdividers 3281-3284 may include skew control to ensure that criticalanalog events do not occur simultaneously with digital switching events,which may reduce analog system noise.

FIG. 33 illustrates a block diagram of one embodiment of a clock divider3300 (3261-3268, FIG. 32). Clock sources 3301 are coupled to the inputsof MUX 3310. The output of MUX 3310 is coupled to the counter block 3320and target count detection block 3330. Divider count register block 3340is coupled to counter block 3320. Target count detection block 3330 iscoupled to output resync/bypass blocks 3340 and 3345. Clk_sync_* signal3371 is coupled to output resync/bypass block 3340. Clk_sync_d* signal3373 is coupled to output resync/bypass block 3345. Output resync/bypassblock 3340 and en_clk_* signal 3372 is coupled to counter block 3320 andclock gating blocks 3350 and 3355. Clock gating blocks 3350 and 3355have output clock signals clk_a*3361 and clk_ad* 3362. In oneembodiment, digital clock divider 3300 may consist of a multiplexer, aclock divider (which may divide by 2 and higher) that generates clockswith a duty cycle, system clock resynchronization logic and deglitchlogic. In one embodiment, the duty cycle may be approximately 50%. Inother embodiments, the duty cycle may be substantially more or less than50%. The outputs from each digital clock tree may be routed into the DSIand brought back into the clock system as an input, allowing clockchaining.

A USB clock domain shown in FIG. 15 (1540) may operate substantiallyasynchronously from the main clock network shown in FIGS. 32 and 33.This allows USB communication to run at the bus frequency withoutburdening the rest of the system generally or the CPU and clockingsubsystem specifically. USB logic may contain a synchronous businterface to the chip, while running on an asynchronous clock to processUSB data. USB logic may require a specific clock frequency, which can begenerated from several sources including the DSI clock though a multipleof the IMO (e.g., 3210 FIG. 32) a DSI signal or an external crystaloscillator.

Power Management Subsystem

The power management subsystem is used to power internal circuits indifferent power modes and to regulate the external supply. The powermanagement system, with proper control from a power manager, keeps theappropriate domains powered in different power modes to achieve thelowest possible current for required device operation.

FIG. 34 illustrates a state diagram for power modes that may beimplemented and managed by the power management system. Power modes areentered and exited based on power and processing requirements of theapplication. Power modes may be controlled by the CPU based on programexecution or may be controlled by an external controller through writingto registers within the power subsystem. Active 3410 and standby 3420may be the main processing modes for standard device operation. A hybridmode called low power active (LPA) 3415 may use the ILO and IMO toenable automatic, duty-cycled alternation between active and standbymodes. Idle 3430, sleep 3440 and hibernate 3450 may be used when thesystem is expected to not require active mode for an extended period oftime. Limited active 3460 may be a transitional mode that allows earlyaccess to a limited subset of device capabilities and resources, whilecertain areas are the chips are enabled in a startup sequence.

Each power controllable subsystem may be enabled or disabled using powerconfiguration settings. Power configuration settings may indicate whichsubsystems are enabled during different modes. In one embodiment, thepower configuration settings may include bits for active and standbymode, which configure different sets or subsets of subsystems to beenabled. Idle, sleep and hibernate modes may disable all subsystemsregardless of the configuration settings in one embodiment. In anotherembodiment, idle, sleep and hibernate modes may have still differentsets of subsystems enabled. Subsystems may be marked as unused toprevent them from resuming from idle, hibernate or sleep mode. This mayreduce power overhead of device wake-up by not powering up unusedsubsystems. Available subsystems may be automatically and dynamicallyenabled and disabled whenever the configuration settings are updated ora global power mode changes. Global power mode changes are affected by awake up event or register write. A wake up event may automaticallyreturn the device to active mode and enable the CPU, regardless of theconfiguration settings. Active mode may be the default global power modeon boot. In other embodiments, a wake up event may automatically returnthe device to a mode different from active mode. In such embodiments,the mode may be a transitional mode that is entered long enough todetermine the correct power mode.

Hibernate mode may be used to maintain power to limited static RAM,retention registers and a bare minimum of logic during low-power domain.The same elements that are maintained in hibernate may be maintained insleep mode with the addition of the ILO, low-speed crystal oscillatorand the central timewheel. Standby and LPA modes may configure thedevice to have its LDOs ON, but at low frequency or clock-gated. Thiscreates low current load on the LDOs, though the LDOs are capable ofhandling a high-current load instantaneously. In one embodiment, one LDOmay be operational, while the other is not, but its operation gated by awakeup event to the first LDO.

Wakeup events may be configurable and may come from an interrupt, andexternal wakeup source, an LPA scheduler or a reset. A wakeup eventrestores the system t active mode. Interrupt sources for wakeup eventsinclude: user interrupts, watchdog timer (WDT) and the central timewheel(CTW). User interrupt sources may be programmable in firmware and can begenerated from a variety of device peripherals, such as analogcomparators and UDBs. The CTW may provide periodic interrupts to producewakeup events, poll peripherals or perform real-time functions. Externalwakeup sources may include PICUs, comparators and test controllerwakeups. An LPA scheduler may issue automatic wakeup events.

Resets may be generated to reset the device to a desired power mode.Reset event sources may include: dedicated external resets, configurableexternal resets, precision resets and a watchdog reset (WDR). Impreciseresets (IRESs) may be disabled during boot, causing them to beunavailable as a valid wakeup source. Other reset sources include anexternal reset (XRES), software reset (SRES) and watchdog timer reset(WRES). XRES may be through a general purpose IO pin or a dedicated XRESpin. Such a pin, if configured holds the device in reset while in a pinstate. In one embodiment the state that maintains the device in reset isactive low. The response to an XRES is the same as a power-on reset(POR). SRES may be initiated by a bit of a software reset register. Thebit of the software reset register may be set directly by the programduring operation of indirectly through DMA access. The response to anSRES is the same as a POR. WRES detects when the device program is nolonger being executed properly. In one embodiment the device programruns a function to indicate to the WDT that it is running correctly.Failure to do so within a specified amount of time may indicate faultyoperation of the device program and instigates a SRES.

Table 1 illustrates possible interrupts, resets, clocks and wakeupsources for each power mode according to one embodiment.

TABLE 1 Interrupt and Clock Sources by Power Mode Mode Wakeup SourceReset Clocks Active External, RTC, CTW, All IMO, ILO/ECO, FTW, User,Reset User LPA External, RTC, CTW, All IMO (cycled), FTW, User, ResetILO/ECO, User Standby External, RTC, CTW, All IMO (optional), FTW, User,Reset ILO/ECO, User Idle/Sleep External, RTC, CTW, External, ILO/ECOReset Hibernate, WDR Hibernate External, Reset External, — Hibernate

FIG. 35 illustrates a block diagram of power management subsystem 3500from FIG. 1 (171). Power management subsystem 3500 includes analog,digital and IO supply pins 3401, 3402.1-3402.2 and 3403.1-3404.3,respectively. Analog regulator 3510 is coupled to analog supply pin 3501and to analog power output pin 3511. Analog regulator 3510 suppliespower to the analog domain 3515. Digital regulator 3520 is coupled todigital supply pins 3502.1-3502.2 and to digital power output pins3521.1-3521.2. Digital regulator 3520 supplies power to digital domain3525. Digital supply pins 3502.1-3502.2 supply power to sleep regulator3530, I2C regulator 3540 and hibernate regulator 3550.

FIG. 36 illustrates a boost converter 3600 as part of the powermanagement subsystem (e.g., SMP 175, FIG. 1) according to oneembodiment. Though not shown, one of ordinary skill in the art wouldunderstand that a buck converter could also be implemented as part ofthe power management subsystem. Boost converter may be used to providepower to the system when the available voltage is below the systemsoperational voltage. Boost converter 3600 includes the device 3610.Device 3610 includes Vdda pin 3601, Vddd pin 3602 and Vddio pin 3603which are all coupled to Vboost pin 3606. Capacitors 3642 and 3643 arecoupled between includes Vdda pin 3601, Vddd pin 3602 and Vddio pin 3603collectively and Vssa pin 3605 and Vssd pin 3604, respectively.Schottkey diode 3648 is coupled between Vboost pin 3606 and Ind pin3607. Inductor 3647 is coupled between Ind pin 3607 and Vbat pin 3608.Battery 3645 and capacitor 3640 are coupled in parallel between Vbat pin3608 and Vssb pin 3609. Schottkey diode 3625 is coupled between Vboostpin 3606 and Ind pin 3607 as part of SMP circuit 3620. Vssb pin 3609 iscoupled to one electrode of SMP transistor 3630, which is part of SMPcircuit 3620. The input of Schottkey diode 3625 is coupled to a secondelectrode of SMP 3630.

The boost converter of the core architecture may be used to boost thesupply voltage from lower supply levels to the device operationalvoltage. The boost converter may accept a lower input voltage andproduces a selectable output voltage using an external inductor,sourcing enough current to operate the device and other on-boardcomponents. In one embodiment, the boost converter may accept voltagesbetween 0.5V and 5.5V and output a user configurable output voltage of1.8V to 5.0V and deliver up to 50 mA.

The boost converter may be operated in two modes set by writing toregisters by the CPU or DMA controller: active and standby, according toone embodiment. Active mode is the normal mode of operation where theboost regulator actively generates a resulted output voltage. In standbymode, most boost functions are disabled, which may reduce powerconsumption of the boost circuit. The booster converter may beconfigured to provide low power, low current regulation in standby mode.In another embodiment, an external 32 kHz crystal may be used togenerate inductor boost pulses on the rising and falling edges of theclock when the output voltage is less than the programmed value.

Input/Output (IO)

Device IOs may possess both analog and digital capabilities and becapable of supporting a number of drive modes. IO may be in one of threecategories: general purpose IO (GPIO), special IO (SIO) or USB IO(USBIO). GPIO and SIO may provide similar digital functionality, withthe primary differences being analog capability, drive strength, inputthreshold and output signaling voltage. USBIO may be capable of supportspecific USB functionality and some limited GPIO functionality. All IOpins may be available for use as digital inputs and outputs for both theCPU and digital peripherals. In additional, some or all IO may becapable of generating an interrupt. GPIOs may be used for analog input,capacitive sensing and LCD segment drive. SIOs may be used for voltagesin excess of the analog supply voltage.

GPIO may support the following features:

-   -   user programmable port reset state,    -   separate IP supplies and voltages for up to four groups of IO,    -   digital peripherals using DSI to connect to pins,    -   input of output or both the CPU and DMA    -   multiple drive modes,    -   an interrupt source configured as rising edge, falling edge or        both edges; Level-sensitive interrupts may be supported through        the DSI,    -   dedicated port interrupt vector for each port,    -   slew rate controlled digital output drive mode,    -   access port control and configuration registers on either        port-basis or pin-basis,    -   separate port-read and -write data registers to avoid        read-modify-write errors,    -   specialized functionality,    -   LCD segment drive,    -   capacitive sensing,    -   analog input and output capability,    -   continuous clamp current,    -   standard drive strength.

FIG. 37 illustrates a block diagram of a GPIO 3700. GPIO 3700 includesfour sections: digital input path 3710, digital output path 3720, analog3740 and LCD 3750. Digital input path 3710 includes interrupt logic 3712which has connections to PICU[x]INTTYPE[y], PICU[x]INTSTAT, PRT[x]PS andPICU[x]INTSTAT signals as well as and to the pin interrupt signal,digital system input and Schmitt trigger 3714. PRT[x]CTL and PRT andPRT[x]DBL_SYNC_IN are coupled to Schmitt trigger 3714. Schmitt trigger3714 couples to pin 3701 and to drive logic 3722 of digital output path3720. Digital output path 3720 includes signals PRT[x]SLW, PRT[x]SYNCOUT, PRT[x]DR, PRT[x]BYP, PRT[x]DM2, PRT[x]DM1, PRT[x]DM0 and PRT[x]BIEas well as connections to the Digital System Output and BidirectionalControl. PRT[x]SLW is coupled to Slew Control 3724. PRT[x]SYNC OUT iscoupled to drive logic 3722. PRT[x]DR and the Digital System Output arecoupled to inputs of MUX 3721. The output of MUX 3721 is coupled to theinput of drive logic 3722 and to the display data input of logic and MUXblock 3755 of LCD 3750 . PRT[x]BYP is coupled to MUX 3721 as a MUXcontrol signal. The Digital System Output is also coupled to an input ofMUX 3741 of analog section 3740. PRT[x]DM2, PRT[x]DM1 and PRT[x]DM0 arecoupled to drive logic 3722. Bidirectional Control and PRT[x]BIE arecoupled to inputs of AND logic 3723. PRT[x]BIE is coupled to an outputof AND logic 3723 and to MUX 3741 as a control signal. The output of ANDlogic 3723 is coupled to the OE input of drive logic 3722. Slew control3724 is coupled to drive logic 3722 and PRT[x]SLW as well as to gates oftransistors 3725-3728. A first side of transistor 3725 is coupled to anTO voltage, Vio, and a second side of transistor 3725 is coupled to pin3701 and a first side of transistor 3726. The second side of transistor3726 is coupled to ground. A first side of transistor 3727 is coupled toan IO voltage, Vio, and a second side of transistor 3727 is coupled topin 3701 through resistor 3729 and a first side of transistor 3726through resistors 3729 and 3730. The second side of transistor 3728 iscoupled to ground. Pin 3701 is coupled to IO voltage, Vio, through diode3731 and to ground through diode 3732. Analog section 3740 includes MUX3741 coupled to the Digital system Output at its input and to an inputof MUX 3742 at its output. CapSense Global Control also couples to aninput of MUX 3742. CAPS[x]CFG1 is coupled to MUX 3742 as a controlsignal. Analog Global Enable and Analog Mux Enable are coupled to pin3701 through switches 3745 and resistors 3747 and 3748, respectively.Switches 3745 are controlled by the output of MUX 3742 ANDed with eitherPRT[x]AG or PRT[x]AMUX for the Analog Global Enable and Analog MuxEnable, respectively. LCD section 3750 includes logic and MUX block 3755with connections to the output of MUX 3621, PRT[x]LCD_COM_SEG, PRT[x]LCDEN and five LCD Bias Bus lines. Logic and MUX block 3755 is coupled topin 3701 through resistor 3757.

SIO may support the following features:

-   -   user programmable port reset state,    -   separate IP supplies and voltages for up to four groups of IO,    -   digital peripherals using DSI to connect to pins,    -   input of output or both the CPU and DMA,    -   multiple drive modes,    -   an interrupt source configured as rising edge, falling edge or        both edges;    -   level-sensitive interrupts may be supported through the DSI,    -   dedicated port interrupt vector for each port,    -   slew rate controlled digital output drive mode,    -   access port control and configuration registers on either        port-basis or pin-basis,    -   separate port-read and -write data registers to avoid        read-modify-write errors,    -   specialized functionality,    -   high drive strength,    -   hot swap (input voltage tolerance at any operating voltage),    -   programmable and regulated high input and output drive,    -   higher over voltage tolerance,    -   general purpose comparator.

FIG. 38 illustrates a block diagram of SIO 3800. SIO 3800 includesdigital input path 3810 and digital output path 3820. Digital outputpath 3810 includes buffer thresholds block 3812, Schmitt trigger 3814and interrupt logic block 3816. Buffer thresholds block 3812 is coupledto PRT[x]SIO_HYST_EN, PRT[x]SIO_OFF and Reference Level signals. Theoutput of buffer thresholds block 3814 and the PRT[x]DBL_SYNC_IN signalare coupled to Schmitt trigger 3814. PICU[x]INTTYPE[y], PICU[x]INTSTATand Pin Interrupt signals are coupled to interrupt logic block 3816.Interrupt logic block 3816 is also coupled to Schmitt trigger 3814.PRT[x]PS and the Digital System Input is coupled to interrupt logicblock 3816 and Schmitt trigger 3814. Schmitt trigger 3814 is coupled topin 3801. Digital output path 3820 includes drive logic block 3821, ANDlogic 3822, MUX 3823, slew control block 3824 and high-voltage driver3825. Reference Level and PRT[x]SIO_CFG are coupled to inputs ofhigh-voltage driver 3825. PRT[x]SLW is coupled to slew control block3824. PRT[x]DR and the Digital System Output are coupled to drive logicblock 3821 through MUX 3823 which is controlled by the PRT[x]BYP signal.PRT[x]DM2, PRT[x]DM1 and PRT[x]DM0 are coupled to drive logic block3821. Bidirectional Control and PRT[x]BIE are coupled to drive logicblock 3821 through AND logic 3822. Drive logic block 3821 is coupled toslew control block 3821. Slew control block is coupled to gates oftransistors 3826-3729. A first side of transistor 3825 is coupled to anoutput of high-voltage driver 3825 and a second side of transistor 3826is coupled to pin 3801 and a first side of transistor 3827. The secondside of transistor 3827 is coupled to ground. A first side of transistor3828 is coupled to an output of high-voltage driver 3825 and a secondside of transistor 3828 is coupled to pin 3801 through resistor 3830 anda first side of transistor 3829 through resistors 3830 and 3831. Thesecond side of transistor 3829 is coupled to ground. Pin 3801 is coupledto ground through diode 3832.

USBIO may support the following features:

-   -   Low-, full-, high or super-speed USB 2.0 compliance,    -   high drive strength,    -   input, output or both for CPU and DMA,    -   input output or both for digital peripherals,    -   digital output drive mode,    -   pin configuration as rising edge, falling edge, or both edges.

FIG. 39 illustrates a block diagram of USBO 3900. USBIO 3900 includesdigital input path 3910 and digital output path 3920. Digital input pathincludes Schmitt trigger 2914 and interrupt logic block 3916. USBreceiver circuitry is coupled to pin 3901. Schmitt trigger 3914 iscontrolled by the PRT[x]DBL_SYNC_IN signal. Schmitt trigger 3914 has aninput coupled to pin 3901. The output of Schmitt trigger 3914 is coupledto the USBIO_CR1[0,1]signal, the Digital System Input and interruptlogic block 3916. Interrupt logic block 3916 is also coupled toPICU[x]INTTYPE[y], PICU[x]INSTAT and Pin Interrupt signals. Digitaloutput path 3920 includes MUX 3921 and drive logic 3922. TheUSBIO_CR1[4,5] signal and Digital System Output are coupled to drivelogic 3922 through MUX 3921, which is controlled by the PRT[x]BYPsignal. PRT[x]SYNCH_OUT, USBIO_CR1[7], USBIO_CR1[2], USBIO_CR[3] andUSBIO_CR[6] are coupled to drive logic block 3922. USB SIE control forUSB mode is also coupled to drive logic block 3922. Drive logic block3922 is coupled to gates of transistors 3923, 3924, 3925 and 3927. Afirst side of transistor 3923 is coupled to an IO voltage, Vio. Thesecond side of transistor 3923 is coupled to pin 3901 and to a firstside of transistor 3924. A second side of transistor 3924 is coupled toground. A first side of transistor 3925 is coupled to an IO voltage,Vio. A second side of transistor 3925 is coupled to pin 3901 throughresister 3926. Pin 3901 is coupled to an IO voltage, Vio, and groundthrough diodes 3929 and 3930, respectively. On the D+ pin of USBdevices, transistor 3927 is coupled between an IO voltage, Vio and thepin through resistor 3928.

Each GPIO and SIO may be individually configurable into one of a numberof drive modes. These drive modes may include: high-impedance analog,high-impedance digital, resistive pull up, resistive pull down, opendrain drives low, open drain drives high, strong drive, and resistivepull up and down. Pin drive modes may be selected by configuring the pindrive mode register. FIGS. 40A-40H illustrates simplified pin viewsbased on the drive mode settings.

FIG. 40A illustrates a pin configured as high-impedance analog. Pin 4001is not coupled to DR 4002 or PS 4003. In this mode, the output driverand the digital input buffer are turned off, which prevents any currentfrom flowing in the IOs digital input buffer due to a floating voltage.

FIG. 40B illustrates a pin 4001 configured as high-impedance digital.Input buffer 4010 is enabled between pin 4001 and PS 4002. DR 4002 isstill unconnected.

FIG. 40C illustrates a pin 4001 configured as resistive pull up.Resistor 4040 provides series resistance to Vio through transistor 4030,while transistor 4035 provides strong drive to ground.

FIG. 40D illustrates a pin 4001 configured as resisitive pull down.Resistor 4045 provides series resistance to ground through transistor4035, while transistor 4030 provides strong drive to Vio.

FIG. 40E illustrates a pin 4001 configured as open drain drives low.Transistor 4035 provides strong drive to ground, while the lack of aconnection to Vio provides high impedance to Vio.

FIG. 40F illustrates a pin 4001 configured as open drain drives high.Transistor 4030 provides strong drive to Vio, while the lack of aconnection to ground provides high impedance to ground.

FIG. 40G illustrates a pin 4001 configured as strong drive. Transistor4030 provides strong drive to Vio and transistor 4035 provides strongdrive to ground. This configuration provides strong CMOS output drive ineither high or low state. This configuration may not be used for inputpins under normal circumstances.

FIG. 40H illustrates a pin 4001 configured as resistive pull up anddown. Resistor 4040 provides series resistance to Vio through transistor4030, while resistor 4045 provides series resistance to ground throughtransistor 4035. This state is similar to the resistive pull up andresistive pull down states, except that the pin is always in series witha resistor. The high data state is pull up, while the low data state ispull down.

Pins may be configured through register settings. Registers may alsointeract with pins. IO registers may be available by port, where eachbit of the register corresponds to one port pin. This register form isefficient for quickly reconfiguring multiple port pins simultaneously.IP registers may be available by pin, which combines the eight mostcommonly used port register bits into a single register for each pin.This enables fast configuration changes to individual pins with a singleregister write.

Pins may be high-speed bidirectional capable to provide high impedancedigital drive mode for input signals and a second user selected drivemode such as strong drive for output signals on the same pin, based onthe state of an auxiliary control bus signal. The bidirectionalcapability may be useful for processor busses and communicationsinterfaces such as a SPI slave MISO pin that requires dynamic hardwarecontrol of the output buffer. The auxiliary control bus may route anumber of UDB or digital peripherals generated output enable signals toone or more pins.

GPIO and SIO pins may have fast and slow output slew rate options forstrong and open drain drive modes, not resistive drive modes. The slowedge rate option may be used for signals that are not speed critical andprovides a signal with reduced EMI. Slew rate may be individuallyconfigurable for each pin.

GPIO and SIO pins may be capable of generating interrupt to the system.Pins in each port interface to their own port interrupt control unit(PICU) and associated interrupt event. Each pin of a port may beindependently configurable to detect rising edge, falling edge, bothedge interrupts or to not generate and interrupt at all. Each time aninterrupt event occurs on a pin, its corresponding status bit of aninterrupt status register may be set to “1” and an interrupt requestsent to the interrupt controller, depending on the configured mode forthe pin. Each PICU may have its own interrupt vector in the interruptcontroller and the pin status register providing determination of theinterrupt source down to the pin level. Port pin interrupts may remainactive in all sleep modes, allowing the system to wake from anexternally generated interrupt. UDBs may provide level-sensitiveinterrupt capability to the system when required.

GPIO and SIO input buffers may be configurable at the port level for thedefault CMOS input thresholds or optional LVTTL input thresholds. Inputbuffers may incorporate Schmitt triggers for input hysteresis or inputbuffers may be disabled for each drive mode.

Analog connections to GPIO pins may configure GPIO as analog inputs,analog outputs or both. Each GPIO ma connect t one of the analog globalbusses or to some of the analog MUX busses to connect any pin to anyinternal analog resource such as an ADC or comparators. Some or all pinsmay provide direct connections to specific analog features such as thehigh current DACs or uncommitted opamps. Additionally, all GPIO may beused to create capacitive sensing (CapSense™) channels.

GPIO may be used to generate segment and common drive signals for directglass drive of LCD glass.

SIO pins may provide regulated high output levels for interface toexternal signals that are lower in voltage than the SIO's respectiveVddio. SIO pins may be individually configurable to output either thestandard Vddio or the regulated output, which is based on an internallygenerated reference. A voltage DAC (VDAC) may be used to generate aninternally regulated reference.

SIO pins may support standard CMOS and LVTTL input levels as well asdifferential mode with programmable levels. SIO pins may be grouped intopairs, each pair sharing a reference generator block which ma be used toset the digital input buffer reference level for interface to externalsignals that differ in voltage from Vddio. The reference may set pins'voltage threshold for a high logic level. In some embodiments, availableinput thresholds may be 0.5× Vddio, 0.4× Vddio and 0.3× Vddio. A VDACmay generate the reference voltage.

The adjustable input level of SIOs may be used to construct acomparator. Thresholds for the comparator constructed from theadjustable input level of an SIO may be provided by the SIOs referencegenerator. The reference generator may have the option to set the analogsignal routed through the analog global line as the threshold for thecomparator. Hysteresis may be enabled for the input buffer to increasethe immunity of the comparator.

“Hot Swap” capability may be supported by SIO pins to enable them toplug into applications without loading the signals that are connected tothe SIO pins even when no power is applied to the system. This allowsthe system to maintain a high impedance load to an external drive devicewhile also preventing the system from being powered through a GPIO pin'sprotection diode when the system is unpowered.

IO pins may provide over voltage tolerance at any operating Vdd. Thismay allow a connection to a bus such as I2C where different devices arerunning from different supply voltages. The system may be configured tobe open drain, drives low mode for an SIO pin. This allows an externalpull up to pull the I2C bus voltage above the system pin supply.

IOs may be default reset to high impedance analog drive mode and may bereprogrammable on a port-by-port or pin-by-pin basis. IOs may be resetas high impedance analog, pull down or pull up based on the applicationrequirements. Port reset configuration data may be stored in specialnonvolatile registers to ensure correct operation. The stored reset datamay be automatically transferred to the port reset configurationregisters at PPOR release

IO pins may retain their state in low power mode until the system isawakened and changed or reset. The system may be awaked through aninterrupt due to the pins ability to run normally at low power modes.

Pins may have additional functionality beyond that of GPIO, SIO andUSBIO pins. Additional digital functionality may include:

-   -   Support for a 4-33 MHz crystal oscillator,    -   Support for a 32.768 kHz crystal oscillator,    -   Wake from sleep on I2C address match,    -   JTAG interface,    -   SWD interface,    -   SWV interface,    -   External reset (XRES).

Additional analog functionality may include:

-   -   Opamp inputs and outputs,    -   High current DAC (IDAC) outputs,    -   External reference inputs.

CPU Subsystem

Core architecture 100 (FIG. 1) may include a CPU subsystem (140, FIG.1). The CPU subsystem is the system controller. It controls digital,analog, mixed-signal and communication functions of the system bywriting to registers, generating interrupts, configuring interconnectsand executing device programs stored in memory. In one embodiment, theCPU subsystem have the following features:

-   -   a single-cycle 8051 CPU,    -   flash memory, EEPROM and SRAM (discussed in the Memory Subsystem        section),    -   a direct memory access (DMA) controller,    -   a peripheral HUB (PHUB), and    -   an external memory interface (EMIF, discussed in the Memory        Subsystem section).

The CPU subsystem may support a plurality of addressing modes including:direct addressing, indirect addressing, register addressing, registerspecific instructions, immediate constants, indexed addressing and bitaddressing. For direct addressing, the operand may be specified by adirect address field and only internal RAM and SFRs may be accessed. Forindirect addressing, the instruction may specify the register whichcontains the address of the operand. Two registers may then be used tospecify the address while the data pointer register (DPTR) may be usedto specify a new address. For register addressing, certain instructionsmay access one of a plurality of registers in a specified register bank.In these applications, these instructions may be more efficient due tothe lack of an address field requirement. For register specificinstructions, some instructions may be specific to certain registers.For immediate constants, some instructions may carry the value of theconstants directly instead of an address. For indeed addressing, theDPTR may be used as the base and an accumulator as an offset to read aprogram memory. For bit addressing, the operand may be one of a numberof bits. In one embodiment, the number of bits for bit addressing may be256. In another embodiment the number of bits may be more or less than256.

The CPU subsystem may be optimized for bit handling and Booleanoperations. The types of instructions supported may including:arithmetic instructions, logical instructions, data transferinstructions, Boolean instructions, and program branching instructions.Arithmetic instructions may support the direct, indirect, register,immediate constant and register specific instructions. Arithmetic modesmay be used for addition, subtraction, multiplication, division,increment and decrement operations. Logical instructions may performBoolean operations such as AND, OR, XOR on bytes, rotate of accumulatorcontent and sap of nibbles in an accumulator. The Boolean operations onthe bytes may be performed on a bit-by-bit basis. Data transferinstructions may be one of plurality of types including core RAM, xdataRAM and look-up tables (LUTs). Core RAM transfer functions may includetransfer between any two core RAM locations or SFRs and may use direct,indirect, register and immediate addressing. Xdata RAM transferfunctions may include only the transfer between the accumulator and thexdata RAM location and my only use indirect addressing. The LUT transferfunction may involve nothing by the read of program memory using indexedaddressing mode. Boolean instructions may include a plurality of bitoperations such as move, set clear, toggle, OR and AND instructions andthe conditional jump instructions. Program branching instructions mayinclude conditional and unconditional jump instructions to help modifythe program execution flow.

FIG. 41 illustrates a block diagram 4100 of a peripheral HUB (PHUB) 4110(143, FIG. 1). The PHUB provides connections to the system for the CPU(141, FIG. 1) and the DMA controller (144, FIG. 1) for configuration ofsystem and subsystem elements, routing of signals throughout the system(from analog to digital subsystems, vice versa and to GPIO). PHUB 4110is coupled to a TD/Configuration block 4122, system memory 4120, CPU4101 and a plurality of spokes to peripherals 4124. PHUB 4110 includes aCPU interface block 4170 coupled to CPU 4101 and a spoke arbitrationblock 4140 coupled to the plurality of spokes to peripherals 4124, DMAcontroller (DMAC) block 4150 and a local spoke/PHUB CSR block 4142through an PHUB-external connection. Local spoke/PHUB CSR block 4142 isalso coupled to CHn CSR blocks 4180 and local memory ARB block 4130,which is coupled to TD/configuration memory block 4122 and DMAC block4150. DMAC block 4150 is coupled to spike arbitration block 4140, localmemory ARB block 4130, CHn CSR blocks 4180, CH ARB block 4160 and systemmemory 4120. CHn CSRs blocks 4180 are coupled to CH ARB block 4160.

The PHUB may be a programmable and configurable central hub within thecore architecture that ties the various on-chip system elements togetherusing standard AMBA AHB. The PHUb may use a multilayer AHB architectureto allow for simultaneous AMBA-Lite style mastering. The PHUB may beconfigured in a number of ways by writing to PHUB configurationregisters to suit the needs of particular core architecture in anapplication. The PHUB may contain a direct memory access controller(DMAC, 144, FIG. 1) may can be programmed to transfer data betweensystem elements without burdening the CPU. The PHUB may contain logicthat performs arbitration between DMAC and the CPU for access to thePHUB's peripheral spokes.

CPU subsystem may include an interrupt controller (142, FIG. 1) toimplement interrupt priorities and associated interrupt address vectors(IAVs). The interrupt controller may provide a mechanism for anyhardware resource to change program execution to a new address,independent of the current task being executed by the CPU. Interruptsmay have programmable priority, which may be level-based. In oneembodiment, there may be 8 levels assignable to any interrupt, whereinlevel 0 is the highest priority and level 8 is the lowest. In otherembodiments there may be more or less than eight levels. Interrupts maybe maskable. In one embodiment, if two interrupts have the same prioritylevel, the interrupt with a smaller index value will be the winner. Anexample of this would be if two interrupts (int_in[5] and int_in[6])each have a priority level of 3, the smaller-indexed interrupt(int_in[5]) will be the serviced interrupt.

Programming and Debug Subsystem

The core architecture may include extensive support for programming,testing, debugging and tracing hardware and firmware. The programmingand debug subsystem main include a variety of interfaces including JTAG,serial wire debug (SWD), and serial wire viewer (SWV). In oneembodiment, JTAG and SWD may support all available programming and debugfeatures of the device, while SWV may support and subset of availablefeatures. JTAG may also support standard JTAG scan chains forboard-level test and chaining multiple JTAG devices to a single JTAGconnection. Debug on chip may support full device debugging in the finalsystem using the standard production device and may not require specialinterfaces, debugging pods, simulators or emulators. A softwaredevelopment and programming environment such as the PSOC Creator IDEoffered by Cypress Semiconductor Corporation (San Jose, Calif.) may beused to provide integrated programming and debug support.

The JTAG interface may be used for programming the flash memory,debugging, IO scan chains and JTAG device chaining. The SWD interfacemay provide an alternative to the JTAG interface. The SWD interface mayrequire only two pins rather than the four or five needed for JTAG. SWDmay provide all the programming and debugging features of JTAG at thesame speed.

JTAG and SWD interfaces may be used to support the following debugfeatures:

-   -   halt and single-step the CPU,    -   view and change CPU and peripheral registers and RAM addresses,    -   multiple program address breakpoints,    -   memory access breakpoints (break on reading or writing any        memory address and data value),    -   break on a sequence of breakpoints,    -   debugging at full CPU speed,    -   debug operations while device is in reset or in low-power modes.

JTAG and SWD interfaces may be used to support the following tracefeatures:

-   -   trace of program counter (PC), accumulator register (ACC) and        one SFR/core RAM register,    -   trace depth up to 1000 instructions if all registers are traced        or 2000 instructions if only the PC is traced,    -   program address trigger to start tracing    -   trace windowing (only trace when PC is within a given range)    -   multiple modes for handing trace buffer full, continuous        (overwriting the oldest trace data) or break when trace buffer        is full.

The SWV interface may be closely associated with the SWD interface butmay also be used independently. SWV may be used for application debugwhen it is helpful for the firmware to output data similar to ‘printf’debugging on personal computers. The SWV interface may be used for datamonitoring and can be implemented using only one pin. The SWV interfacemay output data in standard UART format or Manchester encoded format.

In one embodiment, debugging for the core architecture may be completedwhen the device is in power-down mode or in other low-power modes. Inthis embodiment, some logic remains on at all times (functional ordebug) which includes the debug interface and a small portion of thePower Manage (PM Always-On) which monitors the power down status and hasthe ability to wake-up the chip. The debug interface allows a debuggingsoftware interface to communicate to the logic that is always on andissue commands to read the device's power mode status, wake-up thedevice or reset the device. In another embodiment, a Watchdog resetblocker may be used rather than forcing a reset. In such cases thedesigner has the option to halt the CPU first in any power mode.

FIG. 42 illustrates one embodiment of a debug subsystem 4200. Debuginterface 4210 is coupled to an input of AND logic block 4215. WatchdogTimer (WDT) 4220 is also coupled to an input of AND logic block 4215.The output of AND logic block may be a reset signal 4218 for the device.This allows the debug system to stop a reset event from the WDT untilafter debugging is complete. Debug interface 4210 is coupled to an inputof OR logic block 4225 along with the device signals. The output of ORlogic block 4225 is coupled to power manager (PM) always-on block 4230.PW always-on block is coupled back to debug interface 4210 and to thedebug-on-chip (DOC) block 4242. Debug subsystem 4200 may also include atleast one domain. Domain 1 4240 includes the DOC block 4242, the CPU4244, a power manager 4246 as well as other logic elements 4248. Thepower manager may be used to power specific parts of the device for thepurposes of debugging those parts without powering up the entire device.Debug subsystem 4200 may include more domains 4250 and 4260. Each domainmay have multiple peripherals, 4252, 4254, 4262 and 4264 includedtherein. While two domains beyond domain 1 4240 are shown, it would beobvious to one of ordinary skill in the art to have more of less thantwo domains or even no additional domains. Furthermore, while twoperipherals per domain are shown, it would be obvious to one of ordinaryskill in the art to have more or less than two peripherals in a singledomain.

While debugging the device in normal mode, the selected debug interfaceconnects to a set of pins and the core logic. One of these pins servesas a clock while the additional pins are used for data input, dataoutput and control signals. An external device connects to these pins,requiring only signal generation capabilities, is used to send read orwrite commands to the selected debug interface. In most cases thesecommands are then passed on to the Debug On-Chip (DoC), which is used tooverride the CPU and gain access to the rest of the device. In somecases the command stops at the debug interface when accessing its localregisters. The debug interface contains the local register required tointeract with the Power Manager (PM). These bit fields may include:

-   -   RESET—Used to reset the chip to a known state,    -   WAKE_UP—Used to wake up the all domains from a low power mode,    -   CPU_CLK_IND—CPU clock indication, indicates if the CPU clock is        running,    -   PM_STATUS [N:0]—Power Manager status, indicates which power        domains are on or off.

These register listed above can be accessed in any low power mode, evenwhen the CPU is powered down. When the CPU is powered up so is the DoC.In this mode, breakpoints and trace may be utilized and internal CPUregisters, such as the PC and the accumulator, may be accessed. Anexample of other logic that could exist in other domains is a USB block,an I2C block, programmable digital blocks, and programmable analogblocks. This capability allows a firmware designer to debug power savingimplementations of the device in-system and to monitor the power savingimplementations.

In another embodiment, more and different chip status bits or optionsmay be added to the debug interface, which is always on relaying more ordifferent information when all of the core logic is asleep.

The ability to debug in low-power modes and even in power-down modeprovides the ability to observe which power domains are turned off andmeasure current consumption in the multiple low powers modes whendebugging, and use the collected data as measurement for how the partwill perform in these low power modes when in functional mode.Additionally, it may be possible to wake-up or reset the part from thedebug interface when the part is in a low power mode prior methodsrequire the part to be power cycled or the use of an external reset pin.

FIG. 43 illustrates one embodiment for a method 4300 of debugging asystem. A debug through power mode or reset event command is received inblock 4305. A break point is then enabled in block 4310. The break pointmay be enabled on the desired power mode or on a reset event. The eventis masked by the enable break point of block 4310. The break point ismonitored and its triggered status detected in decision block 4315. Ifthe break point is not triggered, decision block 4315 is repeated. Ifthe break point is determined to be triggered by decision block 4315,the device's debug readiness is monitored in decision block 4325. If thedevice is determined to be ready to enter a debug mode in decision block4325, a standard debug is enabled in block 4330. If the device isdetermined not to be ready to enter a debug mode in decision block 4325,a non-standard debug mode is enabled in block 4340. A non-standard debugmode may query the device's power mode and wake up the device if anappropriate power mode is not running. The non-standard debug mode maythen wake up the device and halt the CPU to suspend device operationduring debugging. The non-standard debug mode may then ready adebug-on-chip section to execute the debug. After a non-standard debugis enabled in block 4340, the debug event is monitored in decision block4345. If a debug event is not completed in decision block 4345, thedebug event continues to be monitored. If the debug event is completed,the device is then monitored to suppress an event in decision block4355. If an event is to be suppressed in decision block 4355, the eventis cleared in block 4360. If the event is not to be suppressed indecision block 4355, the mask from block 4310 is removed and the normalresult from the event is executed in block 4370. The device is thenmonitored to determine if the break point may be removed on execution orclearing of the event in decision block 4375. If the break point isdetermined not to be removed in decision block 4375, the break point ismonitored again in decision block 4315. If the break point is to beremoved in decision block 4375, debugging is ended in block 4385.

In some embodiments, the reset that triggers the debug operation inblock 4305 may be passed to the device through the debug interface aftercompletion of the debug event. This allows the device to be debugged inits current state and then be reset after debug is completed. The resetmay cause the device to enter a different power mode or to executecommands that may mask the state of the device before the reset eventwas triggered and debug mode was enabled.

Although the present invention has been described with reference tospecific example embodiments, it will be evident that variousmodifications and changes may be made to these embodiments withoutdeparting from the broader spirit and scope of the invention as setforth in the claims. Accordingly, the specification and drawings are tobe regarded in an illustrative rather than a restrictive sense.

In the foregoing specification, the invention has been described withreference to specific example embodiments thereof. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense.

What is claimed is:
 1. A circuit comprising: a plurality of programmabledigital blocks configured according to at least one configurationregister, wherein at least one programmable digital block is for issuinga direct memory access (DMA) request in response to an event detected bythe plurality of programmable digital blocks; a DMA controller coupledto the at least one programmable digital block, the DMA controller forretrieving configuration information from a memory and writing theconfiguration information to the at least one configuration registerupon receipt of the DMA request.
 2. The circuit of claim 1, furthercomprising: a digital system interconnect (DSI) coupled to the pluralityof programmable digital blocks and the DMA controller.
 3. The circuit ofclaim 1, further comprising: a peripheral HUB (PHUB) coupled to theplurality of programmable digital blocks and the DMA controller.
 4. Thecircuit of claim 1, wherein the plurality of programmable digital blocksare programmable logic arrays.
 5. The circuit of claim 1, wherein the atleast one programmable digital block is coupled to an interruptcontroller for generating an interrupt signal.
 6. The circuit of claim1, wherein the program information written to the at least oneconfiguration register is for dynamically reconfiguring the plurality ofprogrammable digital blocks in response to the DMA request.
 7. Thecircuit of claim 6, wherein the dynamically reconfiguring the pluralityof programmable digital blocks in response to the DMA request isperformed without central processing unit (CPU) control.
 8. A methodcomprising: receiving a direct memory access (DMA) request from at leastone of a plurality of programmable digital blocks in response to anevent detected by the plurality of programmable digital blocks;retrieving configuration information using a DMA controller from amemory in response to the DMA request; and writing the programinformation using the DMA controller from the memory to at least oneconfiguration register.
 9. The method of claim 8, further comprising:reconfiguring a programmable circuit in response to the programinformation written to the at least one configuration register, whereinthe reconfiguration is performed without action by a central processingunit (CPU).
 10. The method of claim 8, wherein the DMA request isreceived through a digital system interconnect (DSI) coupled to the atleast one of the plurality of programmable digital blocks.
 11. Themethod of claim 8, further comprising: generating an interrupt with aninterrupt controller coupled to the at least one of the plurality ofprogrammable digital blocks, the interrupt provided to a centralprocessing unit (CPU).
 12. A system comprising: a central processingunit (CPU); a memory; a programmable circuit comprising a plurality ofprogrammable digital blocks configured according to at least oneconfiguration register, wherein at least one programmable digital blockis for issuing a direct memory access (DMA) request in response to anevent detected by the plurality of programmable digital blocks; a DMAcontroller coupled to the at least one programmable digital block, theDMA controller for retrieving configuration information from a memoryand writing the configuration information to the at least oneconfiguration register upon receipt of the DMA request.
 13. The systemof claim 12, further comprising: a digital system interconnect (DSI)coupled to the plurality of programmable digital blocks and the DMAcontroller.
 14. The system of claim 12, further comprising: a peripheralHUB (PHUB) coupled to the CPU, the plurality of programmable digitalblocks, and the DMA controller.
 15. The system of claim 12, wherein theplurality of programmable digital blocks are programmable logic arrays.16. The system of claim 12, wherein the at least one programmabledigital block is coupled to an interrupt controller for generating aninterrupt signal.
 17. The system of claim 16, wherein the interruptsignal is provided to the CPU.
 18. The system of claim 12, wherein theprogram information written to the at least one configuration registeris for dynamically reconfiguring the programmable circuit in response tothe DMA request.
 19. The system of claim 18, wherein the dynamicallyreconfiguring the programmable circuit in response to the DMA request isperformed without central processing unit (CPU) action.
 20. The systemof claim 12, wherein the DMA controller is coupled to an interruptcontroller for providing interrupt signals to the CPU.